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An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates

Kai Wu , Jin-Yu Zhang , Gang Liu , Jiao Li , Guo-Jun Zhang , Jun Sun

金属学报(英文版) doi:10.1007/s40195-016-0375-4

An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be ~5.0 J/m2 for Cu/Cr, ~4.1 J/m2 for Cu/Ta, ~2.8 J/m2 for Cu/Mo, ~1.1 J/m2 for Cu/Nb, and ~1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.

关键词: niaxial , tensile , testing , Nanostructured , multilayer , films , Flexible , substrates , Buckling , behaviors , Adhesion , energy

Ni-5%W合金基带的辊到辊再结晶

冀勇斌 , 李成山 , 郑会玲 , 朱丽

稀有金属材料与工程

基于轧制态Ni-5%W(原子分数)合金基带短样品在不同温度退火的结果,对Ni-5%W合金长带进行了辊到辊退火处理.分析不同温度下退火后的硬度,通过X射线极图法评价再结晶织构,采用光学显微镜分析基带的微观结构,讨论退火温度对再结晶织构的影响,考察短带与长带再结晶织构的差异.结果发现:长带和短带都具有很强的立方织构.

关键词: 基带 , 辊到辊 , 再结晶 , 立方织构

低损耗ZrTi2O6填充PTFE复合基板性能

吴开拓 , 袁颖 , 张树人 , 闫翔宇 , 崔毓仁

复合材料学报

采用热压成型工艺,制备了一种低损耗ZrTi2O6陶瓷填充聚四氟乙烯(PTFE)的新型微波复合基板材料.采用介质谐振器法研究了ZrTi2O6/PTFE复合材料的微波介电性能(8~12 GHz).结果表明,ZrTi2O6/PTFE复合材料的相对介电常数(εr)和介电损耗(tanδ)随着ZrTi2O6陶瓷体积分数(0~46%)的增加而增大,介电常数实验值与Lichtenecker模型预测值最吻合.ZrTi2O6/PTFE复合材料的热膨胀系数和介电常数温度系数随着ZrTi2O6陶瓷体积分数的增加而减小.46%的ZrTi2O6为较优填料比例,ZrTi2O6/PTFE的相对介电常数为7.42,介电损耗为0.0022(10 GHz).

关键词: 复合材料 , ZrTi2O6 , 聚四氟乙烯 , 介电特性 , 基板

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