H.C.Jiang
,
W.L.Zhang
,
J.P.Zhang
,
W.X.Zhang
,
B.Peng
,
S.Q.Yang
金属学报(英文版)
The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5mA/cm^2, the prepared film array coercivity can reach the maximum.
关键词:
solution PH
,
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,
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