苏博
,
吴有智
,
孟军虎
,
吕晋军
材料科学与工程学报
软刻蚀技术是基于传统光刻蚀技术提出的一系列技术,包括微模塑、转移微模塑和毛细微模塑等,其共同特点是利用弹性模作为微结构转移元件,复制其他方法制备的原始模板的微结构,再用此弹性模进行微结构的成形.因其成本低廉、操作过程简单,为陶瓷微器件的制备提供了一种先进的净成形加工技术.其工艺步骤主要包括:弹性模的制备、浆料或陶瓷预聚体的制备、注模、干燥(交联固化)、脱模和烧结.本文按照制备工艺综述了软刻蚀技术成形陶瓷微器件的研究进展,着重讨论了影响微成形的关键因素,并对将来的研究方向进行了展望.
关键词:
软刻蚀
,
陶瓷微器件
,
弹性模
Lining Lan Shuhong Xie Li Tan Jiangyu Li
材料科学技术（英文）
Sol-gel based soft lithography technique has been developed to pattern a variety of ferroelectric Pb(Zr0:52Ti0:48)O3 (PZT) microstructures, with feature size approaching 180 nm and good pattern transfer between the master mold and patterned films. X-ray diffraction and high-resolution transmission electron microscopy confirm the perovskite structure of the patterned PZT. Piezoresponse force microscopy (PFM) and switching spectroscopy piezoresponse force microscopy (SSPFM) confirm their piezoelectricity and ferroelec-
tricity. Piezoresponse as high as 2.75 nm has been observed, comparable to typical PZT films. The patterned PZT microstructures are promising for a wide range of device applications.
关键词:
Soft lithography
,
Piezoresponse force microscopy
,
PZT
