WAGENDRISTEL A Viena Technical Univessity
,
AustriaHUANG Rongfang Institute of Metal Research
,
Academia Sinica
,
Shenyang
,
ChinaBANGERT H YANG Xia WU Lihang WANG Haifeng PANGRATZ H SKALICKY P Viena Technical University
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Austria Associate Professor
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Institute of Metall Research
,
Academia Sinica
,
Shenyang 110015
,
China
金属学报(英文版)
The microstructure of Ti/TiN multilayer film was studied.It was shown by trans- mission electron microscopy of cross-sectional sample and respective secondary neutrals mass-spectroscopy depth profiling that the film has a periodic alternate multilayered structure:substrate /FeTi/Ti/Ti_2N/TiN/Ti_2N/Ti/Ti_2N/TiN...Ti/Ti_2N/TiN,where FeTi and Ti_2N were the transition layers formed during ion plating.Cross-sectional fracture surface of indentation samples had been obtained and studied with scanning electron microscopy.It was shown that the multilayer film deformed during indentation, formed an indentation pit and a pile-up of materials around the indentation pit.As the applied load increased deformation region extended beyond the film/substratc interface and into the substrate,the interlayer crack in the film and hole formation at the film /substrate interface were initiated.It is also shown that the multilayered Ti/TiN film offered better toughness in comparison with single layer TiN film.
关键词:
multilayer Ti-N film
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null
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null
A.WAGENDRISTEL
,
黄荣芳
,
H.BANGERT
,
杨霞
,
吴立航
,
王海峰
,
H.PANGRATZ
,
P.SKALICKY
金属学报
研究了Ti/TiN多层膜的显微结构,横截面试样的透射电镜研究和二次离子质谱深度分析均表明,该膜具有周期变化的多层结构,即:基体/FeTi/Ti/Ti_2N/TiN/Ti_2N/Ti/Ti_2N/TiN…Ti/Ti_2N/TiN.制备了压痕试样的断口试样,并用扫描电镜进行了观察.结果表明,多层硬膜在压痕试验时发生形变,出现压痕坑,在其周围形成材料堆积.随着所加载荷的增加,形变区扩大,越过膜/基界面进入基体,引起膜内的层间开裂和在膜/基界面上形成孔洞,研究结果表明,和单层TiN相比,Ti/TiN多层膜具有较好的韧性.
关键词:
Ti-N多层膜
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microstructure
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indentation
