Y.H. Tian
金属学报(英文版)
Flip chip bonding has become a primary technology that has found application in the chip interconnection process in the electronic manufacturing industry in recent years. The solder joints of the flip chip bonding are small and consist of complicated microstructures such as Sn solution, eutectic mixture, and intermetallic compounds (IMCs), whose mechanical performance is quite different from the original solder bulk. The evolution of microstructure of the flip chip solder joints under thermal aging was analyzed. The results show that with an increase in aging time, coarsening of solder bulk matrix and AuSn4 IMCs occurred within the solder. The IMCs that are formed at the bottom side of the flip chip bond were different from those on the top side during the aging process. (Cu,Ni,Au)6Sn5 were formed at the interfaces of both sides, and large complicated (Au,Ni,Cu)Sn4 IMCs appeared for some time near the bottom interface after aging, but they disappeared again and thus (Cu,Ni,Au)6Sn5 IMC thickness increased considerably. The influence of reflow times during the flip chip bonding (as-bonded condition) on the characteristics of interfacial IMCs was weakened when subjected to the aging process.
关键词:
lead free solder
,
倒装焊
,
老化
王慧
,
薛松柏
,
陈文学
,
马秀萍
稀有金属材料与工程
采用侵蚀失重法研究Ga、Al对Sn-9Zn钎料在3.5%NaCl水溶液中耐腐蚀性的影响.结果表明,添加Ga元素后,腐蚀产物的粘附性提高,均匀覆盖在钎料表面上,提高了钎料的耐蚀性能;添加Al以后,Zn和Al被选择性腐蚀,腐蚀随着Al含量的增加而加剧.采用热重分析(TGA)和俄歇电子能谱(AES)研究Ga、Al对Sn-9Zn钎料高温抗氧化性的影响.结果表明,Ga可在钎料表面形成一层集肤层;Al可在钎料表面形成一层致密的氧化膜,两者均可阻挡空气中的氧向钎料内部扩散,从而大大改善钎料的高温抗氧化性.
关键词:
Ga
,
Al
,
Sn-Zn
,
无铅钎料
,
耐腐蚀性
,
高温抗氧化性
