黄岩
,
崔建忠
,
马龙翔
金属学报
本文根据概率理论和金属扩散焊接过程中焊接面上原子激活的特点,建立了接合面上原子成键反应的数学模型,从而给出了焊接工艺参数和材料参数对接合强度的影响规律,模型中采用了界面上原子反应激活中心是界面位错及其弹性应力场的假设。文中以7075Al合金扩散焊接实验为基础,对模型进行了定量计算,计算结果与实验结果基本一致。
关键词:
扩散焊接
,
atomic reaction
,
Al alloy
HUANC Yan CUI Jianzhong MA Longxiang Northeast University of Technology
,
Shenyang
金属学报(英文版)
According to probability theory and atomic activation on bonding interface of metals, a mathematical model was developed for the atomic interfacial reaction during diffusion bonding.The effect of parameters of bonding processing and material on the bonding strength was then gained.It was suggested that the activation centre of atomic interfacial reaction of bonding may be,in situ,the boundary dislocation and its elastic stress field. A substantial agreement about the quantitative prediction of the model was made with the results of diffusion bonding experiments for 7075Al alloy
关键词:
diffusion bonding
,
null
,
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