O.I.Shpigunova
,
S. V. Shpigunov
,
Yu.N. Saraev (Institute of Strength Physics and Materials Science
,
Siberian Branch
,
Russian Academy of Sciences
,
Tom- sk
,
Russia)
金属学报(英文版)
In this paper the processes of melting and transfer of an electrode metal to the molten pool, hydrody- namics of molten pool in controlled pulsed arc welding in carbon dioxide have been investigated.The process of pulsed arc welding with systematic short - circuits of the arc gap is realized by adaptive algo- rithms of pulsed control over main energetic parameters of welding - arc current and voltage,arc heated efficiency,peak,short - circuiting current, which provide the dosage of energy for energy for melting and transfer of every for of an electrode metal, the control over fluidity of the weld pool. Physica and mathematical models describing such processes in CO2, origind software hare been developed.The re- sults of physical simulation and mathemaical modelling permit to determine the influence of energetic parameters of the process on the condition of the "power source-electrode-arc-molten pool" electrodynamic system at each moment of time.
关键词:
pulse
,
null
,
null
,
null
陈冰清
,
熊华平
,
郭绍庆
,
张学军
,
孙兵兵
,
唐思熠
材料工程
doi:10.3969/j.issn.1001-4381.2014.04.003
采用钨极氩弧焊方法,使用自行设计制备的NiCuNbCr合金作为焊料,实现Ti3 A1基合金与GH4169高温合金异种材料之间的焊接.采用扫描电镜(SEM)及能谱分析(XEDS)等方法对接头横截面的微观组织进行分析.结果表明:GH4169/焊缝界面以及焊缝均主要由Ni元素的固溶体组成,其中固溶了Cu,Fe,Cr,Nb几种元素;而焊缝/Ti3 Al界面分为3层组织,其相组成从Ti3 Al母材到焊缝方向依次为:固溶了Ni和Cu元素的Ti2 AlNb相、Al(Ni,Cu)2Ti金属间化合物及(Nb,Ti,Mo)固溶体;(Ni,Nb,Cr)及Ni(Cu,Ti)固溶体;Ni的固溶体,固溶元素为Cu,Nb和Cr.接头的平均室温抗拉强度为140.7MPa.拉伸试样断裂于被焊Ti3 Al母材表面的扩散反应层,它主要由固溶了Ni和Cu元素的Ti2 AlNb相与Al(Ni,Cu)2Ti金属间化合物组成,该界面是Ti3 Al/GH4169接头的薄弱环节.
关键词:
Ti3Al基合金
,
Ni基高温合金
,
氩弧焊
,
微观组织
,
力学性能
张华
,
翟洪祥
,
黄振莺
稀有金属材料与工程
采用无焊料电弧焊方法对Ti_3AlC_2陶瓷与Cu(Mg)合金进行焊接.观察分析了接头组织结构和物相组成,测试了焊接试样的弯曲强度.结果表明,Ti_3AlC_2陶瓷和Cu(Mg)合金之间具有良好的可焊接性.在适当的焊接工艺下,接头具有典型显微结构:在靠近Cu(Mg)合金的区域,自生成的细小TiCx颗粒均匀弥散在Cu(Ti, Al, Mg)合金网络内;在靠近Ti_3AlC_2陶瓷的区域,形成TiC_x相与Cu(Ti, Al, Mg)合金相交替层叠的特殊结构.焊接试样的断裂发生在Ti_3AlC_2陶瓷部分,表明接头的抗弯强度高于被焊接的Ti_3AlC_2陶瓷材料.
关键词:
Ti_3AlC_2
,
Cu合金
,
电弧焊
,
显微结构
,
弯曲强度
