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Effect of Grain Boundary on the Wettability and Interfacial Morphology in the Molten Bi/Cu System

Qiangang XU , Haifeng ZHANG , Bingzhe DING , Zhuangqi HU

材料科学技术(英文)

The wetting behavior of molten Bi on polycrystalline Cu substrate and single crystal Cu substrate was studied by the sessile drop method in the temperature range from 673 to 873K. At low temperature the wetting behaviors of molten Bi on both types of Cu substrate were similar. However, at high temperature, the equilibrium contact angle of polycrystalline Cu substrate was lower than that of single crystal Cu substrate, because the preferred dissolution of grain boundaries leads to a smaller liquid/solid interfacial energy for polycrystalline Cu substrate. The formation mechanism of arrow-shaped Cu grains at the Bi/single crystal Cu interface is also discussed.

关键词: Wettability , null , null , null

Alloying Effect Of Ni And Cr On The Ttability Of Copper On W Substrate

X.H. Yang , P. Xiao , S.H. Liang , J.T. Zou , Z.K. Fan

金属学报(英文版)

By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and the wetting mechanisms of copper on W substrate have been investigated in detail. The results show that the wetting angles of Cu on the W substrate are decreased with an increase in the content of Ni or Cr, and also decrease with raising the wetting temperatures. SEM, EPMA, and X-ray diffraction have been used to analyze the interfacial characteristics of the CuNi/W and CuCr/W systems. The results reveal that there is a transition layer about 2--3~$\mu$m in the interface of Cu-4.0 wt pct Ni/W, in which the intermetallic phase Ni4W is precipitated. As to CuCr/W system, no reaction occurs at the interface. The two factors are that the contents of Cr and Ni and the infiltration temperature must be chosen appropriately in order to control the interfacial dissolution and reaction when the Cu-W alloys are prepared by the infiltration method.

关键词: Wettability , null , null , null , null , null

Metal Oxide Nanostructures from Simple Metal-oxygen Reaction in Air

Ting YU , Zexaing SHEN

材料科学技术(英文)

Metal oxide nanostructures (CuO, Co3O4, ZnO and α-Fe2O3) have been successfully fabricated by a simple and efficient method: heating the appropriate metals in air at low temperatures ranging from 200 to 400℃. The chemical composition, morphology and crystallinity of the nanostructures have been characterized by micro-Raman spectroscopy, X-ray diffraction, scanning electron microscopy and transmission electron microscopy. Two mechanisms: vapor-solid and surface diffusion play dominant roles in the growth of metal oxide nanostructures starting with low melting point metals (Zn and Cu) and high melting point metals (Fe and Co), respectively. With sharp ends and large aspect ratio, the metal oxide nanostructures exhibit impressive field-induced electron emission properties, indicating their potentials as future electron source and displays. The water wettability and anti-wettability properties of iron oxide nanoflakes were also discussed in this work.

关键词: Metal oxide , oxide , nanostructures , field , emiss

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