Liubing WANG
金属学报(英文版)
Tests under mechanical strain control were performed to investigate the TMF behavior of Z2CND18.12N within the temperature range between 150-550℃. Different strain amplitudes and phase-angles were applied. Total strain controlled low cycle fatigue test was also performed at the peak temperature of TMF cycling. The results show that the cyclic stress response of the material displayed an initial hardening regime followed by a saturation period and then cyclic softening till failure. The TMF cycling leads to the development of significant amounts of mean stress. Some life prediction models were employed to predict the TMF life of Z2CND18.12N, and the results indicate that the energy-based models provide good prediction on the thermal-mechanical fatigue behaviors of this material. An optical microscopic observation shows that the surface crack initiations and crack propagations are typically transgranular mode.
关键词:
Thermomechanical fatigue
Jing HAN
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Hongtao CHEN
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Mingyu LI
金属学报(英文版)
A small Pb-free solder joint exhibits an extremely strong anisotropy due to the body-centered tetragonal (BCT) lattice structure of β-Sn. Grain orientations can significantly influence the failure mode of Pb-free solder joints under thermomechanical fatigue (TMF) due to the coefficient of thermal expansion (CTE) mismatch of β-Sn grains. The research work in this paper focused on the microstructure and damage evolution of Sn3.0Ag0.5Cu BGA packages as well as individual Sn3.5Ag solder joints without constraints introduced by the package structure under TMF tests. The microstructure and damage evolution in cross-sections of solder joints under thermomechanical shock tests were characterized using optical microscopy with cross-polarized light and scanning electron microscopy (SEM), and orientations of Sn grains were determined by orientation imaging microscopy (OIM). During TMF, obvious recrystallization regions were observed with different thermomechanical responses depending on Sn grain orientations. It indicates that substantial stresses can build up at grain boundaries, leading to significant grain boundary sliding. The results show that recrystallized grains prefer to nucleate along pre-existing high-angle grain boundaries and fatigue cracks tend to propagate intergranularly in recrystallized regions, leading to an accelerated damage after recrystallization.
关键词:
Pb-free solder
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