Niwat Mookam
材料科学技术（英文）
The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An μ-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a Cu3Sn intermetallic phase between the Cu6Sn5 layer and the copper substrate. ε-Cu3Sn with an orthorhombic lattice structure was found together with hexagonal Cu3Sn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range.
关键词:
Soldering
Qingquan Lai
材料科学技术（英文）
Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.
关键词:
Wetting
