赵柏森
,
傅田
,
马睿
,
赵国际
机械工程材料
采用电化学测试、扫描电镜观察、能谱分析等方法,研究了添加质量分数为0.5％的银元素对Sn-9Zn合金在3.5 ％NaCl溶液中电化学腐蚀行为的影响.结果表明:Sn-9Zn合金中均匀的显微组织使腐蚀原电池反应较为均匀,表面锌相作为腐蚀原电池的阳极几乎完全发生了腐蚀溶解;在添加0.5％银的Sn-9Zn合金中,局部形成银锌金属间化合物(IMC),合金成分与组织的不均匀导致腐蚀原电池反应不均衡,合金的自腐蚀电位略有提高,且会发生以锡相为阳极、富银相为阴极的腐蚀原电池反应.
关键词:
锡锌合金
,
微量银
,
电化学腐蚀行为
,
微观形貌
H.Z. Huang
,
X.Q. Wei
,
L. Zhou
,
null
,
null
金属学报(英文版)
The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found that at a heating rate of 5℃ / min, Sn-6.5Zn exhibited no melting range. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests exhibited that Sn-6.5Zn has significantly better wettability on Cu than Sn-9Zn. The reaction layers formed during the spreading tests were examined. When the Zn concentration fell between 2.5wt%-9wt%, two reaction layers were formed at the interface, a thick and flat Cu5Zn8 adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. Only a Cu6Sn5 layer was formed when the Zn concentration decreased to 0.5wt%. The total thickness of the reaction layer(s) between the alloy and Cu was found to increase linearly with the Zn concentration.
关键词:
lead-free solder
,
Sn-Zn合金
,
润湿性
,
界面
,
金属间化
