Chunzhong LIU
材料科学技术（英文）
Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to reduce the flow stress but to increase strain-rate sensitivity of the eutectic SnBi microstructure. While the reduction in the flow stress was related to the coarsening of the eutectic microstructure, the increased creep rate sensitivity was resulted from additional contribution of grain boundary movement to indentation creep.
关键词:
Solder
,
null
,
null
,
null
,
null
杨立军
,
崔健磊
,
王扬
,
梅雪松
,
王文君
,
谢晖
新型炭材料
随着功能器件互连导线的规模逐渐扩大,导线的尺寸不断减小,量子效应明显加强,未来将导致目前采用铜互连技术的微纳功能器件无法遵循传统半导体物理的原理工作.碳纳米管凭借其独特的一维纳米结构而具有优越的电学、热学及机械等性能,有望取代铜连线而成为下一代芯片的互连导线材料,而碳纳米管的互连技术则是结构制造、功能器件制备或其组装不可或缺的重要环节,现已成为国际新材料领域的研究前沿和热点,本文详细概述碳纳米管作为互连导线的优越性能、互连形式、互连技术的最新研究进展以及应用前景.
关键词:
碳纳米管
,
性能
,
互连
,
应用前景
