Xiuhua CHEN
材料科学技术（英文）
Some information on how to use in-situ determined diffusion coefficient of Cu to make barrier layer of Cu metallization in ultra large scale integrations (ULSIs) was provided. Diffusion coefficients of Cu in Co at low temperature were determined to analyze Cu migration to Co surface layer. The diffusion depths were analyzed using X-ray photoelectron spectroscopy (XPS) depth profile to investigate the diffusion effect of Cu in Co at different temperatures. The possible pretreatment temperature and time of barrier layer can be predicted according to the diffusion coefficients of Cu in Co.
关键词:
Cu diffusion
,
null
,
null
,
null
王梅玲
,
杨志刚
,
张弛
材料热处理学报
通过化学镀的方法在Cu基底上制备了不同晶态的Ni-Mo-P镀层,对Ni-1.0 at％ Mo-17.0 at％合金镀层进行了200～600℃C的真空热处理后,利用X射线荧光光谱仪、X射线衍射仪、俄歇电子能谱仪、能量散射谱仪对样品的厚度、成分、物相结构进行了表征与分析.结果表明,随着P含量的增加,合金镀层的晶态由结晶到混晶、非晶转变.随着热处理温度的增加,镀层本身结晶性提高,Cu原子扩散到镀层中,从而影响镀层的晶态.通过计算可得,400和500℃时,Cu扩散量为4.14 at％、6.14 at％.Cu在Ni-1.0 at％ Mo-17.0 at％合金镀层中的扩散激活能为1.11 eV.
关键词:
Cu扩散
,
非晶
,
X射线衍射
