R. Chen
,
G.D. ZhanG
,
R.J Wu and H Sekine(Institute of Composite Materials
,
Shanghal Jiao Tong University Shanghai 200030
,
China)(Department of Aeronautics and Space Engineering
,
Tohoku University Sendai 980
,
Japan)
金属学报(英文版)
The effects of SiC particle and whisker on the strength of aluminum alloy matrix composites have been discussed. The effects of the characteristics of discontinuons reinforcements on the strength of compsites was revealed on the basis of a review of the elastic-plastic finite element method which was applied to predict the stress-strain constituent relationship for particle and whisker reinforeed MMCs. It is snggested that the reinforcement shape or morphology, aspect ratio and distribution in the matrix should be considered in order to get more accumte numerical results. Theoretical strength analysis models predicted the trend of the strength for particle MMCs, but the theoretical results are generally lower compared with the experimental results, especially for the lower strength aluminum alloy. This is becaase strength theories did not consider the change of microstructure of reinforced matrix after particle incorpomtion. We have proposed a combined microstructure strengthening analysis, and the prediction is consistent with the eperimental results.
关键词:
SiC particle
,
null
,
null
,
null
,
null
程韬
,
贾建刚
,
马勤
,
季根顺
,
郭铁明
材料热处理学报
采用X射线衍射仪(XRD)和扫面电子显微镜(SEM)研究了短碳纤维表面镀铜层的物相及镀铜层的生长过程,分析了电沉积镀铜机理,优化了其工艺.结果表明,当镀铜电压为1V时,Cu在碳纤维表面择优位置形核,形核率和长大速度较低,沉积30 min碳纤维表面形成的Cu镀层不完整;1.5V时沉积30 min的Cu镀层完整性较1V时明显改善,电压为2V时沉积30 min可以得到均匀的镀层;当电压为2.5V时,Cu镀层生长速度显著加快,镀层易脱落.
关键词:
短碳纤维
,
电沉积
,
镀铜
,
增强体
