刘岩
,
黄政仁
,
刘学建
,
袁明
无机材料学报
doi:10.3724/SP.J.1077.2009.00817
采用四元Ag-Cu-In-Ti焊料成功地连接了常压烧结SiC陶瓷. 研究了钎焊温度和保温时间对碳化硅连接强度的影响, 同时通过EPMA和TEM分析连接界面的微观结构, 并且探讨了连接的原理. 试验结果表明, 在700～780℃试验温度范围内, 碳化硅的连接强度存在峰值, 最高四点弯曲强度达到了234MPa, 但是连接强度随着保温时间的增加呈现单调下降趋势. 接头微观结构由基体SiC、反应层和焊料三部分组成, 连续致密的反应层紧密连接基体和焊料, 反应层由带状层、TiC层和Ti5Si3层组成, 带状层宽度约20nm, 由Ag、In、Si和少量的Ti、Cu组成. 元素线扫描结果显示焊料中的活性元素Ti含量在反应层内形成峰值, 活性元素Ti与SiC发生反应生成新的反应层是连接的主要因素.
关键词:
Ag-Cu-In-Ti
,
SiC
,
joining strength
,
interface structure
G.L. Li
,
X.M. Meng
,
F. T. Zhang and Y.K. Wu (Laboratory of Atomic Imaging of Solids
,
Institute of Metal Research
,
Chinese Academy of Sciences
,
Shenyang 110015
,
China)
金属学报(英文版)
The atomic level structures of fcc/bcc interfaces in an Fe-9Ni alloy have been examined by means of HREM. It has been found that the orientation of γ /α interface had great effects on its atomic structure. These interfaces with different orientations may be composed of only structural ledges, structural ledges with misfit dislocations,superledges with misfit dislocations or only misfit dislocations. A structural model of growth ledge was suggested. The terrace of growth ledge was composed of structuralledges or misfit dislocations. The atomic structure of the riser of growth ledge was the same as that of the side facet of γlath, which is composed of saperiedges with misfitdislocations.
关键词:
Fe-9Ni alloy
,
null
,
null
,
null
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