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Component Evaporation of Ti-15-3 Melt during ISM Processing

Yanqing SU , Jingjie GUO , HongSheng DING , Songqing LIU , Yuan LIU , GuiZhong LIU , Jun JIA

材料科学技术(英)

How to control melt composition is the key for getting high quality alloy melt. The paper made the following efforts: (1) The activity coefficients in Ti-15-3 melt have been calculated. (2) Taking advantage of the activity coefficients, the evaporation losses of components in Ti-15-3 melt during ISM process have been studied. The calculated results show that there is a critical vacuum degree (about 1.33 Pa) during melting process.

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Physical Simulation of Mold-Filling Processing of Thin-Walled Castings under Traveling Magnetic Field

Yanqing SU , Tiejun ZHANG , Jingjie GUO , Hongsheng DING , Weisheng BI , Jun JIA , Hengzhi FU

材料科学技术(英)

Mold-filling process of thin-walled castings under the condition of traveling magnetic field has been studied by physical simulation method using gallium melt and fast speed photography. Flow morphology and its formation mechanism were obtained and discussed for thin-walled casting. The influences of magnetic field density on the filling ability, filling velocity and mold filling time have been studied. The differences in filling capability between gravity casting and casting under the traveling magnetic field have been compared. The results indicate that the mold filling ability of the gallium melt increases greatly under the condition of traveling magnetic field; the filling time is shortened from 18 s under gravity field to 3 s under the traveling magnetic field and average flow rate of the melt increases from 1.6 to 8.68 cm3/s; the change law of the cross-section morphology of the gallium melt during the mold filling is that at first, the cross-section area does not change, then it decreases gradually. When the front of the melt reaches the end of the mold cavity, the front melt will backfill the mold; the wider the width of mold cavity, the better the mold filling ability. The mold filling ability of gallium melt in mold with upper magnetic conductor is better than that without upper magnetic conductor.

关键词: Traveling magnetic field , null , null , null

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