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Cyclic Deformation and Fatigue Damage Behavior of Cu Monocrystals, Bicrystals and Tricrystals

Zhongguang WANG , Xiaowu LI , Zhefeng ZHANG , Weiping JIA , Shouxin LI

材料科学技术(英文)

In the present work, the cyclic deformation behavior of Cu single crystals oriented for double- and multiple slip as well as Cu bicrystals and tricrystals was investigated under constant plastic strain control at room temperature in air. The main objectives of the study are: (1) to find out the effects of crystallographic orientation and grain boundary (GB) on the cyclic stress-strain (CSS) curves; (2) to compare the cyclic deformation behavior of the double-, multiple-slip crystals, bicrystals and tricrystals with that of single-slip oriented crystals and to correlate the results with those of polycrystals; (3) to examine the corresponding dislocation structures; (4) to investigate the interactions of persistent slip bands (PSBs) with GBs and triple joint (TJ) as well as intergranular fatigue cracking in Cu bicrystals and tricrystals.

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