W. Liu
,
C.Q. Wang
,
Y.H. Tian
,
M.Y. Li
,
null
,
null
,
null
,
null
金属学报(英文版)
Formation of AuSn x intermetallic compounds (IMCs) in
laser reflowed solder joints was investigated. The results showed
that few IMCs formed at the solder/0.1um Au interface.
Needlelike AuSn 4 IMCs were observed at the
solder/0.5 um Au interface. In Sn-2.0Ag-0.75Cu-3.0Bi and
Sn-3.5Ag-0.75Cu solder joints, when the laser input energy was
increased, AuSn 4 IMCs changed from a layer to needlelike or
dendritic distribution at the solder/0.9 um Au interface. As for
the solder joints with 4.0 um thickness of Au surface finish on
pads, AuSn 4, AuSn 2, AuSn IMCs, and Au 2Sn
phases formed at the interface. Moreover, the content of AuSn
x IMCs, such as, AuSn 4 and AuSn 2, which
contained high Sn concentration, would become larger as the laser
input energy increased. In the Sn-37Pb solder joints with 0.9 um
or 4.0 um thickness of the Au surface finish on pads, AuSn 4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.
关键词:
Laser soldering
,
null
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null
