欢迎登录材料期刊网

材料期刊网

高级检索

  • 论文(1)
  • 图书()
  • 专利()
  • 新闻()

Interfacial Electronic Structure of Thin Cu Films Grown on Ar+-ion Sputter-cleaned a-Al2O3 Substrates

Christina Scheu , Min Gao , Manfred Rühle

材料科学技术(英文)

The bonding and electronic structure of Cu/(0001)Al2O3 and Cu/(1120)Al2O3 interfaces has been studied experimentally using spatially-resolved transmission electron energy loss spectroscopy. The specimen were prepared by depositing Cu on single-crystal a-Al2O3 substrates, which have been Ar+-ion sputter-cleaned prior to the growth of Cu. For both orientations of the a-Al2O3 substrate, atomically abrupt interfaces formed as determined by high-resolution transmission electron microscopy. The investigations of the interfacial Cu-L2,3, Al-L2,3 and O-K energy loss near-edge structures, which are proportional to the site- and angular-momentum-projected unoccupied density of states above the Fermi level, indicate the existence of metallic Cu-Al bonds at the Cu/Al2O3 interface independent of the substrate orientation.

关键词: Electronic structure , null , null , null

出版年份

刊物分类

相关作者

相关热词