N.S.Stoloff Department of Materials Engineering
,
Rensselaer Polytechnic Institute
,
Troy
,
New York
,
USAC.T.Liu Metals and Ceramics Division
,
Oak Ridge National Laboratory
,
Oak Ridge
,
Tennessee
,
USA
材料科学技术(英文)
A comprehensive review of low temperature environmental embrittlement in intermetallics is pres- ented. Moisture and hydrogen are shown to severely embrittle many intermetallics, including iron, nickel and titanium aluminides. The roles of composition, microstructure and external test variables are emphasized. Several methods to reduce or avoid embrittlement are described.
关键词:
environmental embrittlement
,
null
,
null
B.W. Wang
,
H. Shen
金属学报(英文版)
Ni-Cr System solar selective thin solid films were prepared by d.c. magnetron reactivesputtering under the atmosphere of O2 and N2. Ni-Cr alloy was chosen as targetmaterial and copper sheets as substrate. Using SEM, Spectrophotometer and Talystepto analyze the relations between the selective characteristic and the structure, theformation and the thickness of the thin films. The aim is to obtain good solar selectivethin films with high absorptance and low emittance, which is applied to flat plate solarheat collectors.
关键词:
solar selective thin film
,
null
,
null
,
null
MA Zongyi YAO Zhongkai Harbin Institute of Technology
,
Harbin
,
China
金属学报(英文版)
The SiC_w/Al composite prepared by squeeze casting has a combination of superior room temperature specific strength and modulus together with excellent thermal properties.The extrusion can make an improvement on the strength and ductility of the composite from 582 MPa as squeeze casted up to 639 MPa,and on the transformation from isotropic to the anisotropic structure.This seems to be explained by the orientation of whiskers and the densification of dislocations in matrix.TEM observation indicates that the stacking fault is the usual planar defect on the SiC_w surface. composite;;SiC whisker;;Al alloy;;microstructure
关键词:
composite
,
null
,
null
,
null
Applied Physics Letters
A bulk nanograined Cu sample embedded with nanoscale twins is produced by means of dynamic plastic deformation at cryogenic temperatures. It exhibits a tensile yield strength of 610 MPa and an electrical conductivity of 95% IACS at room temperature. The unique combination of a high strength and a high conductivity is primarily attributed to the presence of a considerable amount of nanoscale twins which strengthen the material significantly while having a negligible influence on electrical conductivity. (C) 2007 American Institute of Physics.
关键词:
nanocrystalline cu;tensile properties;grain-boundaries;metals;dislocations;resistivity;copper