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EFFECT OF Ar PRESSURE ON STRUCTURAL AND ELECTRICAL PROPERTIES OF Cu FILMS DEPOSITED ON GLASS BY DC MAGNETRON SPUTTERING

P.Wu , F.P.Wang , L.Q.Pan

金属学报(英文版)

Cu films with thickness of 630-1300nm were deposited on glass substrates withoutheating by DC magnetron sputtering in pure Ar gas. Ar pressure was controlled to0.5, 1.0 and 1.5Pa respectively. The target voltage was fixed at 500V but the targetcurrent increased from 200 to 1150mA with Ar pressure increasing. X-ray diffrac-tion, scanning electron microscopy and atomic force microscopy were used to observethe structural characterization of the films. The resistivity of the films was measuredusing four-point probe technique. At all the Ar pressures, the Cu films have mixturecrystalline orientations of [111], [200] and [220] in the direction of the film growth.The film deposited at lower pressure shows more [111] orientation while that depositedat higher pressure has more [220] orientation. The amount of larger grains in the filmprepared at 0.5Pa Ar pressure is slightly less than that prepared at 1. 0Pa and 1.5PaAr pressures. The resistivities of the films prepared at three different Ar pressures rep-resent few differences, about 3-4 times of that of bulk material. Besides the depositionrate increases with Ar pressure because of the increase in target current. The contri-bution of the bombardment of energetic reflected Argon atoms to these phenomena isdiscussed.

关键词: Cu film , null , null , null

小角度直线反走样的改进Wu算法

李铂 , 周建江 , 夏伟杰 , 吴连慧

液晶与显示 doi:10.3788/YJYXS20142904.0605

直线是机载座舱显示画面中最基本的图元,其显示质量对于整个画面的显示效果影响较大,尤其是小角度下直线显示的“麻花”现象一直是影响显示效果的关键问题之一.为了提高小角度下直线的显示效果,本文提出了一种基于Wu算法的亮度渐变改进算法.该算法通过渐进地展现直线从轴方向上的亮度变化过程,减少亮度畸变,有效地改进了显示效果.通过Matlab仿真和FPGA实现,验证了该算法反走样后的小角度直线显示效果明显优于其他算法,而且结合中点画线法后,绘制时间与Wu算法相当.同时该算法还可改善大角度直线和圆弧的显示效果,消除了大角度直线的边缘锯齿,解决了圆弧在小角度部分的虚化问题.因此本文算法可用于对实时性和显示效果要求高的机载座舱显示系统,以缓解飞行员的视觉疲劳.

关键词: 座舱显示 , 反走样 , 改进Wu算法 , 小角度 , FPGA实现

基于Wu反走样的三角形光栅化边缘反走样算法

吴连慧 , 周建江 , 夏伟杰 , 陈雅雯

液晶与显示 doi:10.3788/YJYXS20153001.0163

对于光栅化的三角形,其边缘存在明显的锯齿现象,因此需要进行反走样处理.基于Wu直线反走样算法的思想,考虑了水平直线外侧直接添加插值点的算法和三角形三边外侧反走样的算法.综合两者的优点,在绘制光栅化的三角形的同时,边缘叠加Wu反走样直线,并考虑背景像素灰度值的作用.结果表明,改进的三角形光栅化的边缘反走样算法有效提高了三角形光栅化后边缘的显示效果,该算法计算量小,便于FPGA实现,可用于对图形显示质量要求很高的机载显示系统.

关键词: 反走样 , Wu算法 , 光栅化 , FPGA

碳酸钙粒子增韧高密度聚乙烯的脆韧转变——Wu氏增韧理论聚合物共混物脆韧转变判据的适用条件

胡跃鑫 , 冯玉林 , 姜伟

应用化学 doi:10.3724/SP.J.1095.2011.00521

采用不同尺寸的碳酸钙粒子增韧高密度聚乙烯,研究了不同温度下共混体系的临界粒子间距与碳酸钙粒子尺寸和含量之间的关系,确定了温度是Wu氏增韧理论临界粒子间判据适用性的重要影响因素.结果表明,在17℃下,临界粒子间距与碳酸钙粒子的尺寸和含量无关,该条件下Wu氏增韧理论临界粒子间距判据是适用的;而随着温度的升高,发现临界粒子间距依赖于碳酸钙粒子的尺寸,表明高温条件下,Wu氏增韧理论临界粒子间距判据不再适用.

关键词: 聚合物增韧 , 粒子间距 , 脆韧转变

Effect of P and B on the creep behavior of alloy 718

Materials Letters

The effects of P and B on the creep behavior of 718 alloys are discussed in this paper. The result implies that P and B have little effect on the gamma" and gamma' phases of the alloy, but they can enhance the grain boundary strength by segregating there, which can be of beneficial to the higher creep properties. P also may increase the grains strength through solid solution. The beneficial effect of P and B were presented in both standard IN718 alloy and DA718 alloy. Adding P and B together does a better work than adding P alone. (c) 2006 Elsevier B.V. All rights reserved.

关键词: P and B;718 alloy;creep;grain boundaries;heat treatment;stress rupture;phosphorus;superalloy;boron

Ni-P-(Ni/SiC)P镀层及其工艺条件的研究

宿辉 , 蔡伟 , 曹茂盛

材料科学与工艺 doi:10.3969/j.issn.1005-0299.2008.03.004

为解决Ni-P-(SiC)P镀层中基体的金属键与增强体的共价键间相容性差,增强体颗粒易脱落,镀层性能降低等问题.采用简单的化学镀方法实现了(SiC)P表面修饰、改性,得到了涂覆型改性(Ni/SiC)P,以(Ni/SiC)P为第二相粒子制备了Ni-P-(Ni/SiC)P化学复合镀层,并初步分析了复合镀机理.实验结果表明:温度、pH值、搅拌速率及(Ni/SiC)P加入量对Ni-P-(Ni/SiC)P镀层的沉积速率及沉积量有较大的影响,本实验条件下的最佳温度为82~86℃;最佳pH值为4.2~4.6;最佳搅拌速率为200 r/mim;最佳粒子加入量10 g/L.SEM、EDS分析显示Ni-P-(Ni/SiC)P镀层均匀、致密,Ni、P、Si沉积量大,耐磨性实验证明Ni-P-(Ni/SiC)P化学复合镀层硬度、耐磨性优干常见的Ni-P、Ni-P-(SiC)P镀层.经表面修饰、改性后得到的(Ni/SiC)P可以进一步提高Ni-P-(SiC)P镀层的使用性能.

关键词: 化学镀 , (Ni/SiC)P , 镀层 , 工艺条件 , 耐磨性

Ni-P-(Ni/SiC)P化学复合镀层的研究

宿辉 , 蔡伟 , 曹茂盛

材料工程 doi:10.3969/j.issn.1001-4381.2007.10.010

为解决裸(SiC)p在实际应用中存在的不足,采用简单的化学镀方法对其表面进行改性,得到了包覆型的改性(Ni/SiC)p,以(Ni/SiC)p为第二相粒子制备了Ni-P-(Ni/SiC)p化学复合镀层,经扫描电镜、能量散射仪、硬度等测试,并与常见的Ni-P化学镀层、Ni-P-(SiC)p化学复合镀层比较,结果显示:Ni-P-(Ni/SiC)p镀层具有组成均匀、硬度高、镀层耐磨损等优点,为(SiC)p增强金属镀层及基体材料的研究提供了一个新的思路.

关键词: 化学镀 , (Ni/SiC)p , 镀层 , 硬度

Ni-P合金电镀工艺

王丽丽

电镀与精饰 doi:10.3969/j.issn.1001-3849.1999.05.013

概述了含有Ni化合物、P化合物和添加剂等组成的Ni-P合金镀液及其电镀工艺,可以获得无针孔、附着性和耐蚀性优良的Ni-P合金镀层,且可使用化学镀Ni-P废液,解决了废液回收再利用问题,适用于Cu、Fe及其合金制品的表面精饰.

关键词: Ni-P合金 , 阴极电流密度 , 镀液振动

METALLOGRAPHIC STUDY ON SEGREGATION BEHAVIOUR OF P IN COLD-ROLLED Fe-P ALLOYS DURING ANNEALING

NING Hua ZHANG Lixin Institute of Corrosion and Protection of Metals , Academia Sinica , Shenyang , China

金属学报(英文版)

The segregation behaviour of P and its effect on structure of 70%-reduction cold rolled Fe-P alloys containing different contents of P,e.g.,0.007,0.06 and 0.09% P,during annealing at 200-700℃ under vacuum have been studied by means of metallography and EPMA.The P was found to segregate preferentially along dislocation line during recovery annealing.The P-riched dislocation densing region,the P-depleted region and the sub-grain-like boundary thus formed.The nuclei grow preferentially during recrystallization in such region that the P segregation is more evident and the residual strain by dislocation densing increases to large extent.After recrystallizing,the P segregates along grain boundaries and makes the grains in alloy fine. Engineer,Institute of Corrosion and Protection of Metals,Academia Sinica,Shenyang 110015,China

关键词: P , null , null , null

Fe液中Ca-P平衡的研究

韩其勇 , 张晓东 , 王鹏飞 , 王杰 , 陈冬

金属学报

用Ca与P合成的Ca_3P_2,在1600℃通过Ca_3P_2的分解,测定了纯Fe液中Ca-P平衡常数和活度相互作用系数,得到 K_(Ca_3P_2)=α_(Ca)~3·α_P~2=7.0×10~(-14) e_P~(Ca)=-3.1

关键词: Ca-P平衡 , Ca P

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