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Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

Guisheng ZOU , Jun YANG , Aaiping WU , Genghua HUANG , Deku ZHANG , Jialie REN , Qing WANG

材料科学技术(英文)

Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. The effects of processing conditions on the microstructures and shear strength of the joints were investigated. When Ti foil is used for bonding of tungsten to pure copper but not transformed into liquid solution during the holding time, the strength of the joints is relatively low because of the multiple compound layers with brittleness formed in the bonding zone. The strength of the joints increases significantly if the Ti foil is transformed into liquid solution and is mostly extruded out of the bonding zone. The same phenomena are found in the case when Ti/Ni/Ti multi-interlayers are used for bonding tungsten to CuCrZr alloy.

关键词: Tungsten , null , null , null

乙烷/丙烷混合工质流动沸腾传热研究

陈高飞 , 公茂琼 , 邹鑫 , 吴剑峰 , 汪胜

工程热物理学报

对乙烷、丙烷纯质及三种不同浓度比例的乙烷/丙烷二元混合物在内径为8mm的水平管内进行了饱和流动沸腾传热特性的实验研究,重点分析了热流密度、质量流量的变化对二元混合工质传热系数的影响。选用了4种专用于计算混合物流动换热的关联式,并与实验数据进行了比较,其中Gungor—Winterton and Thome关联式和Zou关联式的预测偏差相对较小,且计算过程较为简单,较适合用于该工况范围的混合工质传热预测。

关键词: 流动沸腾 , 乙烷 , 丙烷 , 传热关联式 , 水平管

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