材料期刊网

Static Recrystallization Behavior of Twin Roll Cast Low-Carbon Steel Strip

XIE Zhi-xiong , GAO Hai-yan , WANG Jun , YU Yan , FANG Yuan , SUN Bao-de

钢铁研究学报(英文版)

The static recrystallization kinetics of low-carbon steel cast strip was investigated by means of interrupted hot tensile tests. As-cast strip was reheated and soaked and its austenite grain size was similar to the width level of the as-cast columnar structure. The tests were carried out on Gleeble-3500 thermomechanical simulator. The deformation temperature is in the range of 800 to 1200 ℃ with strain rate of 001 to 1 s-1. The prestrain is fixed at 004 to 012, and the inter-hit delay time varies from 1 to 3000 s. Effect of deformation conditions and initial microstructure on static recrystallization behavior was investigated. The activation energy (Qsrx) and Avrami exponent (n) of static recrystallization were determined to have 241 kJ/mol and 054 respectively by linear regression of the experimental results. A kinetics model was proposed to describe the static recrystallization kinetics in low-carbon steel cast strip. The predicted softening fractions are in good agreement with the experimental results, indicating that the proposed equations can give an accurate estimate of the softening behaviors for the low-carbon steel cast strip.

关键词: Static recrystallization

In Situ Observation of Solidification Process of AISI 304 Austenitic Stainless Steel

HUANG Fuxiang , WANG Xinhua , ZHANG Jiongming , JI Chenxi , FANG Yuan , YU Yan

钢铁研究学报(英文版)

The solidification process of AISI 304 stainless steel during cooling at a rate of 005 K/s has been observed in situ using a confocal scanning laser microscope (CSLM). The results show that the δ phase appeared first in liquid steel, as the temperature decreased, the γ phase precipitated prior at δgrain boundary at 1 4522 ℃, the liquid steel disappeared at 1 4313 ℃, and then the γ phase precipitated on the δ ferrite. Based on the ScheilGulliver solidification model, the solidification processes of AISI 304 stainless steel are simulated using the Scheil model in ThermoCalc, and the simulation results agree well with the results observed in the experiment.

关键词: stainless steel;confocal scanning laser microscope;strip casting;ThermoCalc

Effect of Coating on Instantaneous Interfacial Heat Transfer During Near-Rapid Solidification

ZHANG Wei , YU Yan , FANG Yuan , LI Jian-guo

钢铁研究学报(英文版)

For many rapid or near-rapid solidification processes, the interfacial heat transfer between the melt and the substrate is a key issue on the cooling and solidification rate of castings. For the purpose of controlling and adjusting of the interfacial thermal resistance, the effects of C/BN, Zn and organic coatings on the instantaneous interfacial heat flux and the solidified structure of AISI304 stainless steel solidification on copper substrate have been investigated by using an experimental simulator. The results show that C/BN coatings can improve the uniformity of heat flux and solidified structure; Zn coating can increase the heat flux and solidification rate in the growth stage of the solidified shell; organic coating will decrease the heat flux and the solidification rate and make re-melted structure on the surface of the solidified shell.

关键词: near rapid solidification , interfacial heat transfer , coating

New criteria of glass forming ability, thermal stability and characteristic temperatures for various bulk metallic glass systems

Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing

Six mathematical criteria used for quantitatively measuring their glass forming ability, thermal stability and characteristic temperatures (temperature of glass transition T-g, crystallization onset T-x and liquidus T-l) of various bulk metallic glasses (BMGs) have been proposed in this article. It is found that the criteria are suitable for evaluating these quantities for BMGs. The estimated results are better than those calculated by Fang et al.'s models and Lu et al.'s gamma criterion, but our analyses indicate that these criteria, defined by the data (Pauling electronegativity xi, atomic radius ri, electron concentration ni and melting temperature T-mi) easily found in literatures, still need to be further refined in future research for shortcomings of the parameters. (C) 2007 Elsevier B.V. All rights reserved.

关键词: bulk metallic glasses;glass forming ability;thermal stability;supercooled liquid regions;mechanical-properties;amorphous-alloys;transition temperature;bond parameters;strength;binary;widths;ag

Intensified alkaline leaching pretreatment of refractory gold concentrates at common temperature and pressure

Transactions of Nonferrous Metals Society of China

A new process for the hydrometallurgy of refractory gold concentrates was presented. The process comprises grinding-leaching, intensified alkaline leaching (IAL), cyanidation and adsorption. In a stirring-type pulverizing-leaching tower mill, the concentrate is ground to <35. 6 μm of 95. 5 % while simultaneously leached by NaOH of 12 kg/t, then carried out intensified alkaline leaching for 48 h by NaOH of 108 kg/t in enhanced agitation tanks with the pulp concentration of 40% solids at the environmental temperature of 9. 5 &SIM; 13. 5 &DEG;C and the environmental pressure of 10(5) Pa. The oxidation rate of As is 94. 9%, and 47. 6% for S. The total consumption of NaOH is only 20% of that theoretically calculated under the conditions of full oxidation at the same oxidation rates of arsenic to arsenate and sulfur to sulfate. The gold leaching rate by NaCN in 24 h is increased from 9. 2% before pretreatment to 94. 2%. The consumption of NaCN is 7. 5 kg/t, which is one times less than that before pretreatment. The extraction cost of gold is about 422 Yuan/t.

关键词: refractory gold concentrates;grinding-leaching;intensified alkaline;leaching (IAL);pretreatment;common temperature and pressure

ATOMIC FORCE MICROSCOPY OBSERVATION OF MAGNETRON SPUTTERED ALUMINUM-SILICON ALLOY FILMS

金属学报(英文版)

粒裕希停桑谩。疲希遥茫拧。停桑茫遥希樱茫希校佟。希拢樱牛遥郑粒裕桑希巍。希啤。停粒牵危牛裕遥希巍。樱校眨裕裕牛遥牛摹。粒蹋眨停桑危眨停樱桑蹋桑茫希巍。粒蹋蹋希佟。疲桑蹋停?##2##3##4##5ATOMICFORCEMICROSCOPYOBSERVATIONOFMAGNETRONSPUTTEREDALUMINUM-SILICONALLOYFILMSJ.W.Wu,J.H.FangandZ.H.Lu(NationalLaboratoryofMoleculeandBiomoleculeElectronics,SoutheastUniversity,Nanjing210096,ChinaManuscriptreceived27October1995)Abstrcat:Twodifferentsurfacemorphologycharacteristicsofmagnetronsputteredaluminumsilicon(Al-Si)alloyfilmsdepositedat0and200℃wereobservedbyatomicforcemicroscopy(AFM).Oneisirregularlyshapedgrainsputtogtheronaplane.TheotherisirregularlyshapedgrainsPiledupinspace.Nanometer-sizedparticleswithheightsfrom1.6to2.9nmwerefirstobserved.Onthebasisoftheseobservationsthegrowthmechanismofmagnetronsputteredfilmsisdiscussed.Keywords:magnetronsputtering,Al-Sialloy,surfacemorphology,atomicforcemicroscopy,filmgrowthmechanism1.IntroductionTheuseofaluminumalloys[1,2],inparticularAl-Si,isacommonfeatureinmanysinglelevelandmultilevelinterconnectionschemesadoptedinthemanufactureofmicroelectronicdevicesbecauseofseveraldesirableproperties.TheAl-Sigrainmorphology(size.geometryanddistributionofgrainsisassociatedwithstepcoverage[3],electromigration[4]andinterconnectsresistivity[5]etc..Thus,characterizationofAl-Sialloysurfacemorphologyisveryimportant,especiallywhenintegratedintensityincreasesandlinewidthsof0.3to0.5μmbecomecommon.Inthepasttwentyyears,theAl-Sialloysurfacemorphologywhichaffectsthereliabilityofmicroelectronicdeviceshasbeenwidelyinvestigatedbyscanningelectronmicroscopy(SEM),transmissionelectronmicroscopy(TEM)etc.[5-7].However,SEMandTEMhavetheirlimitationorinconvenience,forexample,theverticalresolutionofSEMisnothighandTEMneedscomplexsamplepreparation.Recently,anewgrainboundaryetchingmethodwasproposed￣[8]whichalsoneedstroublesomechemicaletching.Atomicforcemicroscopy(AFM),sinceitsemerging,hasbecomemoreandmoreusefulinphysics,chemistry,materialsscienceandsurfacescience,becauseofitshighresolution,easeofsamplepreparationandrealsurfacetopography.Recently,discussion[9,10]waspresentedonhowAFMwillplayaroleinsemiconductorindustry.Asaresponsetothisdiscussion,weusedAFMtoinvestigateAl-SialloysurfacemorphologyandhaveobtainedsomeresultswhichcannotberevealedbySEMorTEM.ThisindicatesthatAFMisagoodcharacterizationtoolinsemiconductorindustry.2.SamplePreparationInourexperiments,aluminumwith30ppmsiliconwassputteredonsiliconsubstrateinbatchdepositionmodeAllthreefilmswiththicknessof1.6μmweredepositedusinganargonsputteringpressureof4.2×10￣-3Pa.TheotherdepositionparametersaredescribedinTable1.Thesubstratewascleanedusingstandardpremetallizationcleaningtechniquespriortofilmdeposition.3.ExperimentalResultsandDiscussionTheAFMmeasurementswereperformedonacommercialsystem(NanoscopeIII,DigitalInstruments,SantaBarbara).Thetipismadeofmicrofabricatedsiliconnitride(Si_3N_4)Itisattachedtoa200μmcantileverwithaforceconstantofabout0.12N/m.Beforethesurfaceofsamplewasexamined.agoodtipwithananometer-sizedprotrusionatitsendwasselectedbeforehand,whichcanbeobtainedbyimagingtheatomicstructureofmicasubstrateandagoldgrid.AtypicaloperatingforcebetweenthetipandAl-Sisamplesurfaceisoftheorderof10￣-8Nandallimagesweretakenatroomtemperatureinair.AtypicaltopographicviewoftheAl-SifilmsisshowninFig.1(allimagescansizeis5by5μma,bandcarerespectivelyforsample1,2,and3).FromFig.la,itcanbeseenthatirregularlyshapedgrainstiltinginvaryingdegreespileupinspace,andgroovesamongtheirregularlyshapedgrainsaredifficulttodecideatacertainarea(wedefineitascharacteristicA).Toourknowledge,onreportsonthesurfacemorphologyhavebeenpresentedbefore.InFig1b,however,irregularlyshapedgrainsassembleonaPlaneandgroovesamongtheirregularlyshapedgrainsareeasytodecide(wedefineitascharacteristicB),whichisinagreementwithmanypreviousreports[5-7].InFig.1c,bothcharacteristicA(arrowA)andcharacteristicB(arrowB)wereobserved.IndoingAFMexperiments,weselectedfivedifferentscanareastobeimagedforeachsampleandfoundthatallimagesofeachsamplearerespectivelysimilartoFig.1a,bandc.Also,wenotedthatthesurfaceofinFig.1a.WethinkthatdepositionparameterswillinfluenceAl-Sisurfacemorphology,andthetiltedgrainsmaybesusceptibletomicrocracking.Byreducingthescansizeareato2by2μm(Fig.2aandb).Weobtainedmanyidenticalresultsasdescribedabove,suchasirregularlyshapedgrainsetc.Forthefirsttime,wefoundnanometersizedparticlesonirregularlyshapedgrainsurfacewhichcannotberevealedbySEMbecausethediameterofthesenanoparticlesisabout10nmandtheheightofthesenanoparticlesisintherangeof1.6to2.9nm.Inimaging,wenotedthatrotatingthescandirectionandchangingthescanfrequencydidnotaffectthestructureofthesegrainsasshowninFig.2aandb,rulingoutthepossibilitythatscanninginfluencedtheshapeoftheseparticlesorcausedsomesimilarimagingartifacts.Also,wenotedthatthenanoparticleswerenotobservedontheslopesofthegrooves(Fig.2aandb).Thisphenomenoncanbeexplainedasfollows:thepotentialenergyattheslopeislargerthanthatelsewhere,sotheparticlesseemmorelikelytobedepositedontheseareaswithlowerpotentialenergy.Fig.2c,scansize250by250nm,isazoomtopographicimage(whiteoutlineinb).Itshowsunevendistributionofthenanoparticles.Andtheheightdifferenceofthenanoparticlesindicatesdifferentgrowingspeed.Wethinkbasedonthemorphologyofnanoparticles,thattheheightdifferenceandunevendistributionofthesenanoparticlesshowdifferentgrowingadvantageandindicatethatatomshaveenoughenergytomovetoasuitablegrowingspot.Theenergymaybefromthefollowingsources:surfacetemperaturefluctuation,stressdifferenceorcollisionbetweenhighspeedsputteredatoms.Thesenanoparticlesgoongrowingandformmanyirregularlyshapedgrains.AndtheseirregularlyshapedgrainsfurtherconnecteachotheraccordingtocharacteristicAorB,finallyformingtheAl-Sisurfacemorphology.4.ConclusionWecandrawthefollowingconclusionsfromtheabove.First,theexperimentalresultsshowedthatAFMisapowerfultooltoinvestigatethedetailsofAl-Sisurfacemorphologywhichcangreatlyenrichourknowledgeofthefilmgrowthmechanism.Second,depositionconditionsplayanimportantroleindeterminingtheAl-Sisurfacemorphology.Third,thetwoAl-Sisurfacemorphologycharacteristicsarethatirregularlyshapedgrainsassembleonaplaneandirregularlyshapedgrainstiltinginvaryingdegreespileupinspace.Fourth,forthefirsttime,nanoparticleswereobservedonirregularlyshapedgrainsurfacewhichsuggestedthatthefilmgrowthmechanismwasbyinhomogeneousnucleation.Acknowledgements-BeneficialdiscussionswereheldwithDr.ZhenandMr.Zhu.ThisworkwaspartiallysupportedbytheNationalNaturalScienceFoundationofChina.RFFERENCES｜｜1D.pramanikandA.N.Saxena,SolidStateTechnol.26(1983)127.2D.pramanikandA.N.Saxena,SolidStateTechnol.26(1983)131.3D.pramanikandA.N.Saxena,SolidStateTechnol.33(1990)73.4S.S.IyerandC.Y.Worg,J.Appl.phys.57(1985)4594.5J.F.Smith,SolidStateTechnol.27(1984)135.6D.GerthandD.Katzer,ThinSolidFilm208(1992)67.7R.J.WilsonandB.L.Weiss,ThinSolidFilm207(1991)291.8E.G.Solley,J.H.Linn,R.W.BelcherandM.G.Shlepr,SolidStateTechnol33(1990)409I.SmithandRHowland,SolidStateTechnol.33(1990)53.10L.Peters,SemiconductorInternational16(1993)62.##61D.pramanikandA.N.Saxena,SolidStateTechnol.26(1983)127.2D.pramanikandA.N.Saxena,SolidStateTechnol.26(1983)131.3D.pramanikandA.N.Saxena,SolidStateTechnol.33(1990)73.4S.S.IyerandC.Y.Worg,J.Appl.phys.57(1985)4594.5J.F.Smith,SolidStateTechnol.27(1984)135.6D.GerthandD.Katzer,ThinSolidFilm208(1992)67.7R.J.WilsonandB.L.Weiss,ThinSolidFilm207(1991)291.8E.G.Solley,J.H.Linn,R.W.BelcherandM.G.Shlepr,SolidStateTechnol33(1990)409I.SmithandRHowland,SolidStateTechnol.33(1990)53.10L.Peters,SemiconductorInternational16(1993)62.##A##BATOMIC FORCE MICROSCOPY OBSERVATION OF MAGNETRON SPUTTERED ALUMINUM-SILICON ALLOY FILMS$$$$J.W.Wu,J.H. Fang and Z.H.Lu (National Laboratory of Molecule and Biomolecule Electronics,Southeast University,Nanjing 210096, China Manuscript received 27 October 1995)Abstrcat:Two different surface morphology characteristics of magnetron sputtered aluminumsilicon(Al-Si)alloy films deposited at 0 and 200℃ were observed by atomic force microscopy(AFM).One is irregularly shaped grains put togther on a plane.The other is irregularly shaped grains Piled up in space. Nanometer-sized particles with heights from 1.6 to 2.9 nm were first observed. On the basis of these observations the growth mechanism of magnetron sputtered films is discussed.

关键词: :magnetron sputtering , null , null , null , null