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On the Methods of Beam Direction and Misorientation Angle/Axis Determination by Systematic Tilt

Yonghua RONG , Gang HE , Shipu CHEN , Genxiang HU , Ming GAO , Robert P.WEI

材料科学技术(英文)

The methods for determining electron beam direction and misorientation angle/axis of grain boundaries are described in this paper. The present methods are based on a series of diffraction spot patterns obtained by systematic tilt of the crystal, combined with simple mathematical calculations. Instead of the use of Kikuchi patterns, the limitations resulting from the visibility or sharpness of Kikuchi lines and the number of Kikuchi pole(s) existed are avoided and a sufficient accuracy of determination has been achieved.

关键词:

Effect of P and B on the creep behavior of alloy 718

Materials Letters

The effects of P and B on the creep behavior of 718 alloys are discussed in this paper. The result implies that P and B have little effect on the gamma" and gamma' phases of the alloy, but they can enhance the grain boundary strength by segregating there, which can be of beneficial to the higher creep properties. P also may increase the grains strength through solid solution. The beneficial effect of P and B were presented in both standard IN718 alloy and DA718 alloy. Adding P and B together does a better work than adding P alone. (c) 2006 Elsevier B.V. All rights reserved.

关键词: P and B;718 alloy;creep;grain boundaries;heat treatment;stress rupture;phosphorus;superalloy;boron

Ni-P-(Ni/SiC)P镀层及其工艺条件的研究

宿辉 , 蔡伟 , 曹茂盛

材料科学与工艺 doi:10.3969/j.issn.1005-0299.2008.03.004

为解决Ni-P-(SiC)P镀层中基体的金属键与增强体的共价键间相容性差,增强体颗粒易脱落,镀层性能降低等问题.采用简单的化学镀方法实现了(SiC)P表面修饰、改性,得到了涂覆型改性(Ni/SiC)P,以(Ni/SiC)P为第二相粒子制备了Ni-P-(Ni/SiC)P化学复合镀层,并初步分析了复合镀机理.实验结果表明:温度、pH值、搅拌速率及(Ni/SiC)P加入量对Ni-P-(Ni/SiC)P镀层的沉积速率及沉积量有较大的影响,本实验条件下的最佳温度为82~86℃;最佳pH值为4.2~4.6;最佳搅拌速率为200 r/mim;最佳粒子加入量10 g/L.SEM、EDS分析显示Ni-P-(Ni/SiC)P镀层均匀、致密,Ni、P、Si沉积量大,耐磨性实验证明Ni-P-(Ni/SiC)P化学复合镀层硬度、耐磨性优干常见的Ni-P、Ni-P-(SiC)P镀层.经表面修饰、改性后得到的(Ni/SiC)P可以进一步提高Ni-P-(SiC)P镀层的使用性能.

关键词: 化学镀 , (Ni/SiC)P , 镀层 , 工艺条件 , 耐磨性

Ni-P-(Ni/SiC)P化学复合镀层的研究

宿辉 , 蔡伟 , 曹茂盛

材料工程 doi:10.3969/j.issn.1001-4381.2007.10.010

为解决裸(SiC)p在实际应用中存在的不足,采用简单的化学镀方法对其表面进行改性,得到了包覆型的改性(Ni/SiC)p,以(Ni/SiC)p为第二相粒子制备了Ni-P-(Ni/SiC)p化学复合镀层,经扫描电镜、能量散射仪、硬度等测试,并与常见的Ni-P化学镀层、Ni-P-(SiC)p化学复合镀层比较,结果显示:Ni-P-(Ni/SiC)p镀层具有组成均匀、硬度高、镀层耐磨损等优点,为(SiC)p增强金属镀层及基体材料的研究提供了一个新的思路.

关键词: 化学镀 , (Ni/SiC)p , 镀层 , 硬度

Ni-P合金电镀工艺

王丽丽

电镀与精饰 doi:10.3969/j.issn.1001-3849.1999.05.013

概述了含有Ni化合物、P化合物和添加剂等组成的Ni-P合金镀液及其电镀工艺,可以获得无针孔、附着性和耐蚀性优良的Ni-P合金镀层,且可使用化学镀Ni-P废液,解决了废液回收再利用问题,适用于Cu、Fe及其合金制品的表面精饰.

关键词: Ni-P合金 , 阴极电流密度 , 镀液振动

METALLOGRAPHIC STUDY ON SEGREGATION BEHAVIOUR OF P IN COLD-ROLLED Fe-P ALLOYS DURING ANNEALING

NING Hua ZHANG Lixin Institute of Corrosion and Protection of Metals , Academia Sinica , Shenyang , China

金属学报(英文版)

The segregation behaviour of P and its effect on structure of 70%-reduction cold rolled Fe-P alloys containing different contents of P,e.g.,0.007,0.06 and 0.09% P,during annealing at 200-700℃ under vacuum have been studied by means of metallography and EPMA.The P was found to segregate preferentially along dislocation line during recovery annealing.The P-riched dislocation densing region,the P-depleted region and the sub-grain-like boundary thus formed.The nuclei grow preferentially during recrystallization in such region that the P segregation is more evident and the residual strain by dislocation densing increases to large extent.After recrystallizing,the P segregates along grain boundaries and makes the grains in alloy fine. Engineer,Institute of Corrosion and Protection of Metals,Academia Sinica,Shenyang 110015,China

关键词: P , null , null , null

Fe液中Ca-P平衡的研究

韩其勇 , 张晓东 , 王鹏飞 , 王杰 , 陈冬

金属学报

用Ca与P合成的Ca_3P_2,在1600℃通过Ca_3P_2的分解,测定了纯Fe液中Ca-P平衡常数和活度相互作用系数,得到 K_(Ca_3P_2)=α_(Ca)~3·α_P~2=7.0×10~(-14) e_P~(Ca)=-3.1

关键词: Ca-P平衡 , Ca P

Ni-P和Ni-Cu-P化学镀层对比研究

赵芳霞 , 刘琛 , 张振忠 , 丘泰

材料保护 doi:10.3969/j.issn.1001-1560.2006.03.020

利用SEM、DSC、XRD、中性盐雾试验和显微硬度分析等手段,对Ni-10.54%P及Ni-9.25%Cu-10.23%P化学镀层的组织特征、相结构转变、热稳定性、耐蚀性和硬度进行了比较.结果表明:(1)两种镀层均匀致密,均为胞状结构和非晶态组织;(2)Ni-P镀层仅发生从非晶相向稳定的Ni3P相转变,而Ni-Cu-P镀层则先生成Ni-Cu固溶体和亚稳中间相Ni5P2,再向稳定相Ni3P转变;(3)Ni-Cu-P镀层的热稳定性高于Ni-P镀层;(4)镀态和低温热处理条件下两种镀层的硬度相差不大,Ni-P镀层经400 ℃、60 min热处理时硬度达到最高值981.1 HV,但Ni-Cu-P镀层经500 ℃、60 min热处理时硬度达到最高值1 144.8 HV;(5)镀态时Ni-Cu-P镀层的腐蚀速率只有Ni-P镀层腐蚀速率的2.85%;经过400 ℃、120 min相同条件的热处理,Ni-Cu-P镀层的腐蚀速率仅为Ni-P镀层腐蚀速率的0.351%.

关键词: 化学镀 , Ni-P , Ni-Cu-P , 热稳定性 , 硬度 , 耐蚀性

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