{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"通过磁控溅射沉积TiN/Ag金属化层作为Cu焊盘的保护层,非晶态的TiN膜作为阻挡层,阻止Cu原子的向外扩散;选择能够与Au丝形成固溶体的Ag薄膜作为<span style=\"color:red\">键</span><span style=\"color:red\">合</span>层,提高<span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>.<span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>测试和抗氧化<span style=\"color:red\">性能</span>测试表明,TiN/Ag金属化层结构作为Cu焊盘保护层,具有较好的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>能力,其<span style=\"color:red\">键</span><span style=\"color:red\">合</span>能力和焊点剪切强度在20-180℃的温度范围内随着温度的升高而升高,在180℃时获得了100%的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>能力,剪切断裂发生在Au球与TiN/Ag<span style=\"color:red\">键</span><span style=\"color:red\">合</span>面.TiN/Ag金属化层较相同厚度的Ag膜具有更强的抗氧化<span style=\"color:red\">性能</span>,原因在于非晶态TiN层对Cu原子的扩散起到了很好的阻挡作用.","authors":[{"authorName":"田艳红","id":"c1615fc8-f802-45ae-b394-82ea16a8f275","originalAuthorName":"田艳红"},{"authorName":"王春青","id":"23a47cb4-4329-4178-ad7c-9016d4417d98","originalAuthorName":"王春青"},{"authorName":"赵少伟","id":"779404de-7e44-4748-829c-c652c3d95401","originalAuthorName":"赵少伟"}],"doi":"10.3724/SP.J.1037.2009.00807","fpage":"618","id":"232144dd-901b-409d-b6ae-448e5ebe89ad","issue":"5","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"0852fcf0-c886-4159-b978-cd98de3f0424","keyword":"Cu互连","originalKeyword":"Cu互连"},{"id":"e6504383-7d57-414b-b750-d127a1f2fe0a","keyword":"金属化层","originalKeyword":"金属化层"},{"id":"24d49a91-b8e1-425e-b0cd-ed79b4d6d3b6","keyword":"<span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>","originalKeyword":"超声键合性能"},{"id":"c96c61b7-48d5-440e-903f-5d01d133971a","keyword":"抗氧化<span style=\"color:red\">性能</span>","originalKeyword":"抗氧化性能"}],"language":"zh","publisherId":"jsxb201005016","title":"Cu焊盘TiN/Ag金属化层<span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>及抗氧化<span style=\"color:red\">性能</span>","volume":"46","year":"2010"},{"abstractinfo":"通过磁控溅射沉积TiN/Ag金属化层作为Cu焊盘的保护层, 非晶态的TiN膜作为阻挡层, 阻止Cu原子的向外扩散; 选择能够与Au丝形成固溶体的Ag薄膜作为<span style=\"color:red\">键</span><span style=\"color:red\">合</span>层, 提高<span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>. <span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>测试和抗氧化<span style=\"color:red\">性能</span>测试表明, TiN/Ag金属化层结构作为Cu焊盘保护层, 具有较好的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>能力, 其<span style=\"color:red\">键</span><span style=\"color:red\">合</span>能力和焊点剪切强度在20-180 ℃的温度范围内随着温度的升高而升高, 在180 ℃时获得了100\\%的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>能力, 剪切断裂发生在Au球与TiN/Ag<span style=\"color:red\">键</span><span style=\"color:red\">合</span>面. TiN/Ag金属化层较相同厚度的Ag膜具有更强的抗氧化<span style=\"color:red\">性能</span>, 原因在于非晶态TiN层对Cu原子的扩散起到了很好的阻挡作用.","authors":[{"authorName":"田艳红王春青赵少伟","id":"8169f1ef-bf49-47f3-9afa-8912efd808df","originalAuthorName":"田艳红王春青赵少伟"}],"categoryName":"|","doi":"DOI: 10.3724/SP.J.1037.2009.00807","fpage":"618","id":"86ce7b36-6a45-497d-b69f-18f7e0f93a76","issue":"5","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"82d9d85a-4ad1-44fb-b62b-add245f0003e","keyword":"Cu互连","originalKeyword":"Cu互连"},{"id":"23236839-b147-470d-a1e1-18404d3a491b","keyword":"metallization","originalKeyword":"metallization"},{"id":"381240b3-fdb5-4ada-818c-de5e7eba1a25","keyword":"ultrasonic bondability","originalKeyword":"ultrasonic bondability"},{"id":"ec6a66b6-a88d-47a6-9ba2-ca1f0fde8eb2","keyword":"antioxidation property","originalKeyword":"antioxidation property"}],"language":"zh","publisherId":"0412-1961_2010_5_3","title":"Cu焊盘TiN/Ag金属化层<span style=\"color:red\">超声键合</span><span style=\"color:red\">性能</span>及抗氧化<span style=\"color:red\">性能</span>","volume":"46","year":"2010"},{"abstractinfo":"为了研究<span style=\"color:red\">超声键合</span>中在<span style=\"color:red\">超声</span>能量作用下金属间形成<span style=\"color:red\">键</span><span style=\"color:red\">合</span>界面而构成<span style=\"color:red\">键</span>合力的机理,确定金属间吸收的<span style=\"color:red\">超声</span>能量与形成的界面质量的关系,在<span style=\"color:red\">超声</span>楔焊<span style=\"color:red\">键</span><span style=\"color:red\">合</span>试验中,对Al-Ni楔焊通过改变焊接参数而获得完全<span style=\"color:red\">键</span><span style=\"color:red\">合</span>和半<span style=\"color:red\">键</span><span style=\"color:red\">合</span>的界面,并对其界面特征进行扫描电镜测试分析;同时,利用示波器采集<span style=\"color:red\">超声键合</span>机焊接时的电信号,分析了PZT驱动的输入阻抗和功率特性,并与界面质量对比.研究结果表明:<span style=\"color:red\">超声键合</span>而形成的Al-Ni界面为中央未<span style=\"color:red\">键</span><span style=\"color:red\">合</span>的椭圆界面;相同参数条件下,一焊输入阻抗和吸收功率大于二焊,一焊的界面质量也高于二焊.","authors":[{"authorName":"陈新","id":"65deef29-610a-4b4b-86bf-1395054f55f3","originalAuthorName":"陈新"},{"authorName":"李军辉","id":"6c329394-4d45-48f3-a6a7-c77f62e90ca1","originalAuthorName":"李军辉"},{"authorName":"钟泽辉","id":"cfeb61c4-6ea9-4303-a52f-7dd8562119e2","originalAuthorName":"钟泽辉"}],"doi":"10.3969/j.issn.1005-0299.2006.04.021","fpage":"416","id":"29227fa2-08ff-4a3e-a6df-e0fc08632ff6","issue":"4","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"dbb3b79c-940e-490e-9bd7-31e09ea53485","keyword":"<span style=\"color:red\">超声键合</span>","originalKeyword":"超声键合"},{"id":"5e30f8c0-9c96-4158-ac7f-9ba9d81e7242","keyword":"界面特征","originalKeyword":"界面特征"},{"id":"0345fa02-efc0-415e-865b-c08332f386e0","keyword":"功率特性","originalKeyword":"功率特性"}],"language":"zh","publisherId":"clkxygy200604021","title":"Al-Ni<span style=\"color:red\">超声</span>楔焊中输入功率与界面<span style=\"color:red\">键</span><span style=\"color:red\">合</span>的特征分析","volume":"14","year":"2006"},{"abstractinfo":"为了提高铜线<span style=\"color:red\">性能</span>及其<span style=\"color:red\">键</span><span style=\"color:red\">合</span>质量,采用拉力-剪切力测试仪、扫描电镜等研究了不同力学<span style=\"color:red\">性能</span>铜线及相应的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>参数对其<span style=\"color:red\">键</span><span style=\"color:red\">合</span>质量的影响,分析了不同伸长率和拉断力、铜线表面缺陷、<span style=\"color:red\">超声</span>功率和<span style=\"color:red\">键</span><span style=\"color:red\">合</span>压力对铜线<span style=\"color:red\">键</span><span style=\"color:red\">合</span>质量的作用机制.结果表明：伸长率过小和拉断力过大会造成焊点颈部产生微裂纹,从而导致焊点的拉力和球剪切力偏低;表面存在缺陷的铜线其颈部经过反复塑性大变形会造成铜线表面晶粒和污染物脱落而出现短路和球颈部断裂;<span style=\"color:red\">键</span><span style=\"color:red\">合</span>过程中键<span style=\"color:red\">合</span>压力过大能够引起的焊盘变形,同时较大的接触应力引起铝层溢出;过大的<span style=\"color:red\">超声</span>功率使<span style=\"color:red\">键</span><span style=\"color:red\">合</span>区域变形严重产生明显的裂纹和引起<span style=\"color:red\">键</span><span style=\"color:red\">合</span>附近区域严重的应力集中,致使器件使用过程中产生微裂纹而降低器件的使用寿命.","authors":[{"authorName":"曹军","id":"f8456175-5542-4c1e-a8f5-0404f33aefb1","originalAuthorName":"曹军"},{"authorName":"丁雨田","id":"55f8fc7b-c0bd-4cee-ba13-d34c0f56615a","originalAuthorName":"丁雨田"},{"authorName":"郭廷彪","id":"1816cb6f-20d3-4f5d-a240-a2e08db3dc0b","originalAuthorName":"郭廷彪"}],"doi":"","fpage":"76","id":"6a548419-b197-4a3c-ac0d-6fbaa0469001","issue":"4","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"065496eb-ce17-4f62-835d-c067a311010b","keyword":"伸长率","originalKeyword":"伸长率"},{"id":"eb60d942-7edb-4dd3-9c62-a37938974cd4","keyword":"拉断力","originalKeyword":"拉断力"},{"id":"712f7f81-52e3-4853-b6eb-3310d27c7252","keyword":"表面","originalKeyword":"表面"},{"id":"ea3451e8-51ce-4280-92dc-0bd9f939e461","keyword":"<span style=\"color:red\">超声</span>功率","originalKeyword":"超声功率"},{"id":"250dc18d-be22-4149-8aeb-05d89ac04399","keyword":"<span style=\"color:red\">键</span><span style=\"color:red\">合</span>压力","originalKeyword":"键合压力"}],"language":"zh","publisherId":"clkxygy201204014","title":"铜线<span style=\"color:red\">性能</span>及<span style=\"color:red\">键</span><span style=\"color:red\">合</span>参数对<span style=\"color:red\">键</span><span style=\"color:red\">合</span>质量的影响","volume":"20","year":"2012"},{"abstractinfo":"针对聚合物多层微流控芯片<span style=\"color:red\">键</span><span style=\"color:red\">合</span>,采用热辅助<span style=\"color:red\">超声</span>波<span style=\"color:red\">键</span><span style=\"color:red\">合</span>方法实现了4层微流控芯片的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>,搭建了多界面温度测试装置,采用埋置热电偶的方法测试了三个被封接界面的温度场,研究了单独<span style=\"color:red\">超声</span>波作用和热辅助<span style=\"color:red\">超声</span>波<span style=\"color:red\">键</span>合法中各界面的温度并进行了比对.温度测试实验结果表明,在顶层热辅助温度70℃、6μm振幅、30kHz频率、100N<span style=\"color:red\">超声</span>波焊接压力和25s<span style=\"color:red\">超声</span>波作用时间下,基于热辅助的多层<span style=\"color:red\">超声</span>波<span style=\"color:red\">键</span><span style=\"color:red\">合</span>方法可以使各键<span style=\"color:red\">合</span>界面的温度基本一致,从而实现多层微流控器件的多个界面<span style=\"color:red\">键</span><span style=\"color:red\">合</span>质量一致.本文的研究为聚合物微流控器件的<span style=\"color:red\">超声</span>波多层<span style=\"color:red\">键</span><span style=\"color:red\">合</span>机理研究提供了有益借鉴.","authors":[{"authorName":"罗怡","id":"9c527c72-e479-460d-ad71-88ea4379c9b6","originalAuthorName":"罗怡"},{"authorName":"何盛强","id":"a77be989-5136-47ee-a190-7c1cdbc1d962","originalAuthorName":"何盛强"},{"authorName":"王晓东","id":"383bec6f-ae95-4334-a567-0949ba5f657f","originalAuthorName":"王晓东"}],"doi":"","fpage":"88","id":"ebf879fb-dc5f-4c32-9284-d31eb7884d89","issue":"1","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"0ec9ca50-5fe6-4a54-9327-79f7eb3bec7f","keyword":"多层微流控芯片","originalKeyword":"多层微流控芯片"},{"id":"910b0b2e-3745-4219-ba3c-4d739163ff7b","keyword":"热辅助<span style=\"color:red\">超声</span>波<span style=\"color:red\">键</span><span style=\"color:red\">合</span>","originalKeyword":"热辅助超声波键合"},{"id":"3185d410-6fc9-4abf-b30f-643ed21c4a29","keyword":"界面温度","originalKeyword":"界面温度"}],"language":"zh","publisherId":"clkxygy201201018","title":"聚合物多层微流控芯片<span style=\"color:red\">超声</span>波<span style=\"color:red\">键</span><span style=\"color:red\">合</span>界面温度研究","volume":"20","year":"2012"},{"abstractinfo":"介绍了硅片的直接<span style=\"color:red\">键</span><span style=\"color:red\">合</span>工艺、<span style=\"color:red\">键</span><span style=\"color:red\">合</span>机理、<span style=\"color:red\">键</span><span style=\"color:red\">合</span>质量评价方法以及<span style=\"color:red\">键</span><span style=\"color:red\">合</span>技术目前的研究和应用状况等.","authors":[{"authorName":"王敬","id":"2877fd15-a710-4d31-aab9-ae169cb24910","originalAuthorName":"王敬"},{"authorName":"屠海令","id":"367b09ba-1f66-4aeb-9194-057e18d9658e","originalAuthorName":"屠海令"},{"authorName":"刘安生","id":"1865ffb5-3eef-4b75-b887-2fe6a22a7043","originalAuthorName":"刘安生"},{"authorName":"张椿","id":"a5db59fc-6d76-49d7-bf03-208be7cef4e2","originalAuthorName":"张椿"},{"authorName":"周旗钢","id":"f0901821-d5e4-4109-993e-2923809b41a3","originalAuthorName":"周旗钢"},{"authorName":"朱悟新","id":"f17b6813-08cd-4989-bc03-317866bf6191","originalAuthorName":"朱悟新"}],"doi":"10.3969/j.issn.0258-7076.1998.05.013","fpage":"380","id":"64d64907-d45d-4aa4-b761-fd0044a537b6","issue":"5","journal":{"abbrevTitle":"XYJS","coverImgSrc":"journal/img/cover/XYJS.jpg","id":"67","issnPpub":"0258-7076","publisherId":"XYJS","title":"稀有金属"},"keywords":[{"id":"43f3c8a6-994e-42ff-a88d-1502a3b2eb72","keyword":"硅片","originalKeyword":"硅片"},{"id":"0c39ddd5-c112-43e6-ad8c-a803e821cde0","keyword":"硅片<span style=\"color:red\">键</span><span style=\"color:red\">合</span>","originalKeyword":"硅片键合"},{"id":"74cd3dc9-e4a6-45ae-8778-3e07d8137e21","keyword":"直接<span style=\"color:red\">键</span><span style=\"color:red\">合</span>","originalKeyword":"直接键合"}],"language":"zh","publisherId":"xyjs199805013","title":"硅片的直接<span style=\"color:red\">键</span><span style=\"color:red\">合</span>","volume":"22","year":"1998"},{"abstractinfo":"Al/Cu<span style=\"color:red\">键</span><span style=\"color:red\">合</span>界面金属间化合物的形成是导致微电子器件失效的重要因素之一,总结了微电子器件生产和使用过程中Al/Cu<span style=\"color:red\">键</span><span style=\"color:red\">合</span>界面金属间化合物的生长规律,分析了Al/Cu<span style=\"color:red\">键</span><span style=\"color:red\">合</span>系统的失效机制.热<span style=\"color:red\">超声键合</span>过程中,Al焊盘上氧化铝层的破裂使金属间化合物的形成成为可能,<span style=\"color:red\">键</span><span style=\"color:red\">合</span>及器件使用过程中,金属间化合物和柯肯德尔空洞的形成和长大最终导致<span style=\"color:red\">键</span><span style=\"color:red\">合</span>失效.采用在Al焊盘上镀覆Ti过渡层的方法,可有效降低<span style=\"color:red\">键</span><span style=\"color:red\">合</span>系统中Cu原子的扩散速度,抑制金属间化合物的生长,从而提高电子元器件的可靠性.","authors":[{"authorName":"岳安娜","id":"05b3f54f-9717-4bc2-bb53-e15e98d52a5d","originalAuthorName":"岳安娜"},{"authorName":"彭坤","id":"41e6d5d7-3eb6-4f91-8b1f-2b71c700a6b4","originalAuthorName":"彭坤"},{"authorName":"周灵平","id":"f4982080-87f6-4ca2-9fe1-f3c683752d7c","originalAuthorName":"周灵平"},{"authorName":"朱家俊","id":"8e39b89a-de4e-4a35-9775-6f56161233ee","originalAuthorName":"朱家俊"},{"authorName":"李德意","id":"554c5847-34fe-4030-8c72-f6304ce97ca0","originalAuthorName":"李德意"}],"doi":"","fpage":"117","id":"769a7714-3ead-4881-b3a8-ede9b18d59da","issue":"17","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"7e6a589f-8615-4ae4-851f-746fd9cc14e1","keyword":"Al/Cu<span style=\"color:red\">键</span><span style=\"color:red\">合</span>","originalKeyword":"Al/Cu键合"},{"id":"4e1526d6-08c7-49f9-bc9f-378382cfdfd1","keyword":"金属间化合物","originalKeyword":"金属间化合物"},{"id":"92f6e559-7b0e-46c9-8fbb-99d94b638b9b","keyword":"扩散","originalKeyword":"扩散"},{"id":"5a96fbd0-838b-4265-aa00-00c13ca8e194","keyword":"Ti过渡层","originalKeyword":"Ti过渡层"}],"language":"zh","publisherId":"cldb201317026","title":"Al/Cu<span style=\"color:red\">键</span><span style=\"color:red\">合</span>系统中金属间化合物的形成规律及防止方法","volume":"27","year":"2013"},{"abstractinfo":"利用扫描电镜、透射电镜、聚焦离子束、强度测试仪研究了<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线无卤直接镀Pd工艺及镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线<span style=\"color:red\">性能</span>,分析了热处理温度对直接镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线钯层界面结合强度、镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线拉断力、伸长率及钯层厚度的影响.结果表明:无卤直接镀Pd工艺可获得镀层均匀的镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线;随热处理温度增加,钯层结合强度增加,热处理温度300℃时,镀层与基体结合强度较低;热处理温度450℃时,直接镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线钯层与基体Cu之间产生了Pd3Cu5金属间化合物,钯层与铜线基体结合强度较好;热处理温度450℃时,直接镀钯铜线具有优良的力学<span style=\"color:red\">性能</span>适当的钯层厚度,镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线拉断力为0.096 N,伸长率为14.3％,钯层厚度为78 nm;热处理温度500℃时镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线晶粒粗大,力学<span style=\"color:red\">性能</span>降低,拉断力为0.073 N,伸长率为11.6％.","authors":[{"authorName":"曹军","id":"1c904307-6328-4ff3-b80a-4b9517179a1b","originalAuthorName":"曹军"},{"authorName":"范俊玲","id":"97346261-7790-438b-a570-2f197ed2fbe6","originalAuthorName":"范俊玲"},{"authorName":"高文斌","id":"738edafc-133b-4723-b2d6-a77bf54cb5e1","originalAuthorName":"高文斌"},{"authorName":"刘志强","id":"45fd77c7-0ed4-43f2-8c19-e45435056a45","originalAuthorName":"刘志强"}],"doi":"","fpage":"171","id":"273799c2-5c5a-4ec4-aea8-e3c9dcca04e0","issue":"3","journal":{"abbrevTitle":"CLRCLXB","coverImgSrc":"journal/img/cover/CLRCLXB.jpg","id":"15","issnPpub":"1009-6264","publisherId":"CLRCLXB","title":"材料热处理学报"},"keywords":[{"id":"31c6d360-bb1a-4579-994d-62d62d8c8539","keyword":"直接镀钯","originalKeyword":"直接镀钯"},{"id":"dca1dd63-9cbd-43b9-999e-4e4eb4678701","keyword":"热处理","originalKeyword":"热处理"},{"id":"8752ed19-8924-40cc-ada4-77ec8fd97c52","keyword":"结合强度","originalKeyword":"结合强度"},{"id":"f15a29cf-0b16-4ed2-ab40-decebc983728","keyword":"Pd厚度","originalKeyword":"Pd厚度"},{"id":"8100e938-3838-4cdd-b0c7-d0f7671ea9f9","keyword":"力学<span style=\"color:red\">性能</span>","originalKeyword":"力学性能"}],"language":"zh","publisherId":"jsrclxb201603030","title":"热处理对直接镀Pd<span style=\"color:red\">键</span><span style=\"color:red\">合</span>Cu线<span style=\"color:red\">性能</span>的影响","volume":"37","year":"2016"},{"abstractinfo":"以3种具有不同比表面积和孔结构的介孔硅胶为基质,采用2种不同的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>方法将β-环糊精引入到介孔材料体系中,结果表明,采用先将偶联剂与β-环糊精反应再在较大体积的反应溶剂中与硅胶<span style=\"color:red\">键</span><span style=\"color:red\">合</span>的方法可得到较大的<span style=\"color:red\">键</span><span style=\"color:red\">合</span>量. 考察了<span style=\"color:red\">键</span><span style=\"color:red\">合</span>前后的介孔硅胶的比表面积和孔结构参数,结果表明β-环糊精的引入使硅胶的比表面积、孔径和孔容均有较明显的下降,孔结构发生变化. 具有最大比表面积的介孔硅胶MS1经适当方法<span style=\"color:red\">键</span><span style=\"color:red\">合</span>改性后,可获得最高的表面β-环糊精修饰量(1.36 μmol/m2),表现出对酚类化合物的强吸附<span style=\"color:red\">性能</span>,尤其是对2,4-二硝基酚吸附量达24.81 mg/g. 从不同的介孔硅胶基质获得的β-环糊精<span style=\"color:red\">键</span><span style=\"color:red\">合</span>材料对于不同的酚类化合物表现出不同的选择性,体现了介孔材料在引入β-环糊精进行<span style=\"color:red\">键</span>合时由于孔结构的不同而导致的差异. 而有序或无序孔结构对于材料的吸附<span style=\"color:red\">性能</span>未发现显著影响.","authors":[{"authorName":"范毅","id":"61deb15d-f109-4036-bf3e-261cff2a64f0","originalAuthorName":"范毅"},{"authorName":"冯钰锜","id":"e36c8648-43e8-473a-ac89-58c99c06cc8b","originalAuthorName":"冯钰锜"},{"authorName":"达世禄","id":"4a5528bc-521b-4dc6-aa45-1f7afbf21baa","originalAuthorName":"达世禄"},{"authorName":"施治国","id":"da23b519-0fc2-43c4-812e-73569b3e70b6","originalAuthorName":"施治国"},{"authorName":"徐丽","id":"ec58cb91-da5b-40ac-a193-c0df5bb44f0c","originalAuthorName":"徐丽"}],"doi":"10.3969/j.issn.1000-0518.2004.09.003","fpage":"878","id":"536df874-4786-4b2a-9dca-1712d29c73a5","issue":"9","journal":{"abbrevTitle":"YYHX","coverImgSrc":"journal/img/cover/YYHX.jpg","id":"73","issnPpub":"1000-0518","publisherId":"YYHX","title":"应用化学"},"keywords":[{"id":"b03d9c75-66d6-486f-9092-61707a2b981c","keyword":"介孔硅胶","originalKeyword":"介孔硅胶"},{"id":"82ac3cc0-577c-4e23-b287-36a50ad43ff5","keyword":"β-环糊精","originalKeyword":"β-环糊精"},{"id":"8fe7c479-7b9a-4661-b8b2-033f5e24a1ec","keyword":"<span style=\"color:red\">键</span><span style=\"color:red\">合</span>改性","originalKeyword":"键合改性"},{"id":"f9dbe86d-1746-462b-82fb-5093701b1aa2","keyword":"吸附<span style=\"color:red\">性能</span>","originalKeyword":"吸附性能"},{"id":"02e461b6-1b5d-470d-bbdf-6025f7bca31f","keyword":"酚类化合物","originalKeyword":"酚类化合物"}],"language":"zh","publisherId":"yyhx200409003","title":"β-环糊精<span style=\"color:red\">键</span><span style=\"color:red\">合</span>改性介孔硅胶的表征和吸附<span style=\"color:red\">性能</span>评价","volume":"21","year":"2004"},{"abstractinfo":"将硅烷偶联剂γ-(2,3-环氧丙氧)丙基三甲氧基硅烷与十八酸反应,再<span style=\"color:red\">键</span>合到硅胶整体柱上,得到了酯型十八烷基<span style=\"color:red\">键</span><span style=\"color:red\">合</span>固定相,并用红外光谱、元素分析对其进行了表征.在以甲醇-水为流动相的反相色谱条件下分离了苯、联苯和蒽的混合样品,评价了该整体柱的色谱<span style=\"color:red\">性能</span>,考察了该整体柱适用的pH范围,以及柱压降、柱效与流速的关系.结果表明,该硅胶整体柱<span style=\"color:red\">键</span><span style=\"color:red\">合</span>效果良好,具有较好的反相色谱<span style=\"color:red\">性能</span>,且在pH=2～8时稳定性好,柱压降、柱效受流速影响较小,可有效地用于化合物的快速分离分析.","authors":[{"authorName":"王利娟","id":"145df584-5ad4-4977-b772-8866a39a6a48","originalAuthorName":"王利娟"},{"authorName":"杨更亮","id":"d9bf62f5-67eb-482e-8ffe-a1433f26161a","originalAuthorName":"杨更亮"},{"authorName":"李煦","id":"d7ce8725-ae21-499e-ac01-2a44cfb59af2","originalAuthorName":"李煦"},{"authorName":"李晓瑜","id":"63943d55-9528-4ec1-a59c-dec814386f96","originalAuthorName":"李晓瑜"},{"authorName":"尹俊发","id":"babf29b7-9e14-4ba2-b3e8-6c6c7eaf879e","originalAuthorName":"尹俊发"},{"authorName":"李志伟","id":"001c28b3-d7ae-4733-8953-93e27463bb82","originalAuthorName":"李志伟"},{"authorName":"高文惠","id":"a13bdff6-42ff-4532-b7fc-4436ab6eeca5","originalAuthorName":"高文惠"},{"authorName":"杨静","id":"56fee71c-213d-4daa-b94d-987619dbb54b","originalAuthorName":"杨静"},{"authorName":"陈义","id":"72f132c2-2b2a-4cc0-b7d5-20ecf2f58e10","originalAuthorName":"陈义"}],"doi":"10.3321/j.issn:1000-8713.2005.05.014","fpage":"504","id":"76ee2a98-9a31-4dda-82aa-076efdc459a2","issue":"5","journal":{"abbrevTitle":"SP","coverImgSrc":"journal/img/cover/SP.jpg","id":"58","issnPpub":"1000-8713","publisherId":"SP","title":"色谱 "},"keywords":[{"id":"e7d9c20c-3444-4c6a-b6ef-1561f9301bf4","keyword":"硅烷偶联剂","originalKeyword":"硅烷偶联剂"},{"id":"358ce620-a0a2-4610-bd0d-d02df106e64a","keyword":"酯型十八烷基<span style=\"color:red\">键</span><span style=\"color:red\">合</span>硅胶整体柱","originalKeyword":"酯型十八烷基键合硅胶整体柱"},{"id":"0c47c365-5650-497d-bf03-012070802207","keyword":"反相液相色谱","originalKeyword":"反相液相色谱"}],"language":"zh","publisherId":"sp200505014","title":"酯型十八烷基<span style=\"color:red\">键</span><span style=\"color:red\">合</span>硅胶整体柱的制备、表征及<span style=\"color:red\">性能</span>评价","volume":"23","year":"2005"}],"totalpage":9105,"totalrecord":91047}