{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"系统研究了等温时效中添加微量稀土Er对Sn-3.8Ag-0.7Cu钎料<span style=\"color:red\">合金</span>显微组织演化规律的影响.结果表明,Er对Sn-3.8Ag-0.7Cu钎料显微组织及等温时效过程中显微组织的演化产生了重要影响.在钎焊过程中,Er有效地细化了钎料组织,改变了钎料内部Cu-Sn金属间化合物的形态、尺寸及分布情况.在等温时效过程中,钎料内部生成的ErSn3金属间化合物为组织的再结晶过程提供了大量的形核质点,有效避免了再结晶组织的粗化及裂纹的产生和扩展.","authors":[{"authorName":"郝虎","id":"4e68c979-db3f-4456-85d4-097cb3f7c310","originalAuthorName":"郝虎"},{"authorName":"史耀武","id":"47e5f264-bfc8-4a1a-8e2e-2ea60baaf340","originalAuthorName":"史耀武"},{"authorName":"夏志东","id":"aa24f0a1-6c81-4240-a834-f4f35dc4f9d5","originalAuthorName":"夏志东"},{"authorName":"雷永平","id":"4188a615-4bcf-4e3c-be99-20fbb05dbb23","originalAuthorName":"雷永平"}],"doi":"","fpage":"1938","id":"57d7f666-78e4-4d45-b205-3af2db9e1c41","issue":"11","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"db1abe53-7ccd-4130-80b5-abf60ed833b8","keyword":"等温时效","originalKeyword":"等温时效"},{"id":"6b2f71ff-bb1e-4643-9df3-b81825621407","keyword":"无铅钎料","originalKeyword":"无铅钎料"},{"id":"17bbac6f-05b3-46e2-8a4e-c91b3f4eb983","keyword":"<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>","originalKeyword":"SnAgCu合金"},{"id":"0556de0c-8499-406a-a104-30326206127a","keyword":"稀土Er","originalKeyword":"稀土Er"}],"language":"zh","publisherId":"xyjsclygc200811012","title":"等温时效中稀土Er对Sn-3.8Ag-0.7Cu无铅钎料显微组织演化的影响","volume":"37","year":"2008"},{"abstractinfo":"研究了添加微量稀土Y对Sn3.8Ag0.7Cu钎料<span style=\"color:red\">合金</span>显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuY<span style=\"color:red\">合金</span>是性能优良的无铅钎料<span style=\"color:red\">合金</span>,同时确定了最佳的Y含量范围.","authors":[{"authorName":"郝虎","id":"dc428e85-df87-4907-9d41-c7076391429a","originalAuthorName":"郝虎"},{"authorName":"田君","id":"e204f065-46e9-43c3-b7bf-1f5807b6e109","originalAuthorName":"田君"},{"authorName":"史耀武","id":"f0debfa8-fa89-4ce4-ac6b-b267d02c7cca","originalAuthorName":"史耀武"},{"authorName":"雷永平","id":"108d9817-878e-46ca-ad7c-a7e8f0512c3a","originalAuthorName":"雷永平"},{"authorName":"夏志东","id":"52774f44-b536-456d-977a-84cd39762ea6","originalAuthorName":"夏志东"}],"doi":"","fpage":"121","id":"353899f9-21ff-4e79-80fc-29808d42dcd9","issue":"z1","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"dc03740b-0b5e-4c17-98c8-fe88f9f38f0c","keyword":"无铅钎料","originalKeyword":"无铅钎料"},{"id":"427932d5-4b54-484a-8762-f78db11c7d93","keyword":"<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>","originalKeyword":"SnAgCu合金"},{"id":"a2c0bcce-602b-47d0-a877-62fb9d32e4d8","keyword":"稀土Y","originalKeyword":"稀土Y"}],"language":"zh","publisherId":"xyjsclygc2006z1030","title":"SnAgCuY系稀土无铅钎料显微组织与性能研究","volume":"35","year":"2006"},{"abstractinfo":"系统研究了添加微量稀土Er对Sn3.8AgO.7Cu钎料<span style=\"color:red\">合金</span>显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuEr<span style=\"color:red\">合金</span>是性能优良的无铅钎料<span style=\"color:red\">合金</span>,同时确定了最佳的Er含量范围.","authors":[{"authorName":"田君","id":"ae5963cc-9c9d-4359-a9f0-765e3896ffd5","originalAuthorName":"田君"},{"authorName":"郝虎","id":"fcaa3e97-c2e0-4985-b4b2-1f307fa933c4","originalAuthorName":"郝虎"},{"authorName":"史耀武","id":"6b7b2d4c-f5a0-4330-adf8-b47381258389","originalAuthorName":"史耀武"},{"authorName":"雷永平","id":"e5bde6ff-8640-4517-a978-9a43e2c4d51c","originalAuthorName":"雷永平"},{"authorName":"夏志东","id":"e17b9ec4-cb97-427d-99a8-f9fce8fdb1e4","originalAuthorName":"夏志东"}],"doi":"10.3969/j.issn.1005-0299.2008.02.034","fpage":"281","id":"4955b437-7d70-4d69-bb81-432521ba2c55","issue":"2","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"6605ac92-48f3-4d39-892f-6a7521b9f564","keyword":"无铅钎料","originalKeyword":"无铅钎料"},{"id":"102f29ff-b4d4-4ace-9234-3bfdb6ab2bc5","keyword":"<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>","originalKeyword":"SnAgCu合金"},{"id":"16c766d2-0bc2-498c-9ad5-d66552415875","keyword":"稀土Er","originalKeyword":"稀土Er"}],"language":"zh","publisherId":"clkxygy200802034","title":"SnAgCuEr系稀土无铅钎料的显微组织与性能研究","volume":"16","year":"2008"},{"abstractinfo":"研究了添加微量稀土Y对Sn3.8Ag0.7Cu钎料<span style=\"color:red\">合金</span>显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuY<span style=\"color:red\">合金</span>是性能优良的无铅钎料<span style=\"color:red\">合金</span>,同时确定了最佳的Y含量范围.","authors":[{"authorName":"郝虎","id":"f8325881-0b51-49b0-b986-c6f1e857bc73","originalAuthorName":"郝虎"},{"authorName":"田君","id":"7b72c1b1-0f62-4d97-a1ec-0af61f7abdc3","originalAuthorName":"田君"},{"authorName":"史耀武","id":"a9fd1b51-207f-4e28-8ebc-de4fb6f29795","originalAuthorName":"史耀武"},{"authorName":"雷永平","id":"7ef637c9-52ba-4328-bd49-f695eec89f22","originalAuthorName":"雷永平"},{"authorName":"夏志东","id":"40176dcd-4ab1-44ec-99f1-a4fc0f266569","originalAuthorName":"夏志东"}],"doi":"","fpage":"121","id":"5f3a3d71-4915-4f55-b9fc-a89256685875","issue":"z2","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"2a31e9d5-87c8-4056-9475-5933bbe28c09","keyword":"无铅钎料","originalKeyword":"无铅钎料"},{"id":"cbf17eb9-7e3e-4817-8b95-9bddabb5e4c9","keyword":"<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>","originalKeyword":"SnAgCu合金"},{"id":"58f1daf4-7342-4556-aab5-e3e0144bcec4","keyword":"稀土Y","originalKeyword":"稀土Y"}],"language":"zh","publisherId":"xyjsclygc2006z2030","title":"SnAgCuY系稀土无铅钎料显微组织与性能研究","volume":"35","year":"2006"},{"abstractinfo":"本文研究了稀土相表面Sn晶须的生长行为.研究结果表明,如果将稀土相暴露于空气中,在稀土相的表面会出现Sn晶须的快速生长现象,且Sn晶须在其快速生长过程中会表现出一些特殊的形态特征,如片状Sn晶须的形成、Sn晶须的多次连续转折现象、Sn晶须的变截面生长现象、Sn晶须的分枝与合并以及Sn晶须的搭接现象等.","authors":[{"authorName":"郝虎","id":"a0d6b5a0-88bd-466a-9cfb-7da31a53007a","originalAuthorName":"郝虎"},{"authorName":"李广东","id":"53db5409-ec72-49f7-9d1d-10e46e9cc16f","originalAuthorName":"李广东"},{"authorName":"史耀武","id":"0b7bfc91-fc98-49aa-aa17-ad227b055f98","originalAuthorName":"史耀武"},{"authorName":"夏志东","id":"4bf2da20-bda1-4634-85a3-b00d5531dae4","originalAuthorName":"夏志东"},{"authorName":"雷永平","id":"e55435ed-ae6c-4cf4-906f-7560105f6fc1","originalAuthorName":"雷永平"},{"authorName":"郭福","id":"86316370-096f-4416-a6ef-244f790161e8","originalAuthorName":"郭福"},{"authorName":"李晓延","id":"308e75df-af4a-4aa4-85d9-f8d7766741f2","originalAuthorName":"李晓延"}],"doi":"","fpage":"111","id":"da35a316-6780-4bea-b30b-2fce7c128971","issue":"1","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"f57d79e8-dc60-42b8-865e-6f4feb5bf8ec","keyword":"<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>","originalKeyword":"SnAgCu合金"},{"id":"33c080ec-7974-487d-a52d-bb618c4d3cdd","keyword":"稀土","originalKeyword":"稀土"},{"id":"febd2225-5626-4c87-8d5e-623f45a55565","keyword":"Sn晶须","originalKeyword":"Sn晶须"},{"id":"ce457001-aa09-416a-92f9-bb44b47f725c","keyword":"形貌特征","originalKeyword":"形貌特征"}],"language":"zh","publisherId":"clkxygy201001024","title":"Sn晶须形态的研究","volume":"18","year":"2010"},{"abstractinfo":"依据定向凝固技术原理,自行开发出可控凝固平台,并利用该平台对SAC305钎料<span style=\"color:red\">合金</span>的凝固行为进行研究,分析定向凝固条件对SAC305钎料<span style=\"color:red\">合金</span>显微组织的影响.在快速冷却条件下,显微组织富锡相有明显定向生长,增大冷却速率可使柱状富锡相连续性增强,并有抑制二次枝晶生长的趋势.快速冷却使金属间化合物尺寸明显减小,弥散分布,达到提高钎料显微硬度的目的.","authors":[{"authorName":"左勇","id":"f6a53d39-25ee-4b1c-8976-edba06dc0b22","originalAuthorName":"左勇"},{"authorName":"马立民","id":"8e58a21e-4c34-4b03-a0ad-74249e1a1daa","originalAuthorName":"马立民"},{"authorName":"徐广臣","id":"b83692c6-ca99-47d9-90a5-295c47b16427","originalAuthorName":"徐广臣"},{"authorName":"郭福","id":"1489cb3d-36d9-4e54-ad69-f8cb6c3afe5f","originalAuthorName":"郭福"}],"doi":"","fpage":"1048","id":"4831e6ca-227d-4201-bbd6-2b9ed977fcee","issue":"5","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"94f427fe-cca2-4d55-968f-074539b8c50c","keyword":"<span style=\"color:red\">SnAgCu</span>","originalKeyword":"SnAgCu"},{"id":"11bef0bd-f488-4957-9d0a-c1d9d0ec43c5","keyword":"凝固","originalKeyword":"凝固"},{"id":"0a6f9adb-e1ee-48f3-a9c1-456460386be5","keyword":"热传导","originalKeyword":"热传导"},{"id":"4514aed8-d194-4e29-bed9-e9c8b166b2c2","keyword":"显微组织","originalKeyword":"显微组织"}],"language":"zh","publisherId":"xyjsclygc201305035","title":"共晶<span style=\"color:red\">SnAgCu</span>钎料<span style=\"color:red\">合金</span>定向凝固研究","volume":"42","year":"2013"},{"abstractinfo":"微细无铅焊料<span style=\"color:red\">合金</span>粉末易团聚和氧化,通过表面改性处理可提高其分散性及抗氧化性.本文以紧耦合气雾化法所制备的<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>粉末为原料,采用真空蒸镀法对<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>粉末进行包覆硬脂酸的改性研究,研究蒸镀温度、蒸镀时间等工艺条件对<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>粉末改性效果的影响;采用扫描电镜(SEM)、透射电镜(TEM)对包覆后<span style=\"color:red\">合金</span>粉末的形貌及结构进行观测,采用X射线光电子能谱仪(XPS) 和碳硫联测仪分别对包覆后粉末的光电子能量和C含量进行测试.研究结果表明:合适的真空蒸镀条件是蒸镀温度70℃,蒸镀时间12h,真空度低于1.6×10~(-2)Pa,在此条件下可得到均匀致密、厚度为5～10nm的包覆层;硬脂酸包覆<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>粉末遵循岛状生长机理,其包覆行为是物理吸附过程.","authors":[{"authorName":"刘文胜","id":"3e4c6409-3c5d-443e-ba9e-3041ed3faa06","originalAuthorName":"刘文胜"},{"authorName":"崔鹏","id":"489e070b-b4c1-46a3-a98f-d6162773e75f","originalAuthorName":"崔鹏"},{"authorName":"马运柱","id":"a3538e1d-ea4e-4162-bc35-81b69e97f644","originalAuthorName":"马运柱"},{"authorName":"彭芬","id":"fb76f51f-c339-4b88-b0b7-6915190127d7","originalAuthorName":"彭芬"},{"authorName":"黄国基","id":"07bfc109-6c93-4df5-9415-c30eecc241f8","originalAuthorName":"黄国基"}],"doi":"","fpage":"144","id":"c8e2ce6d-f2dd-4c00-a465-c05df87d8602","issue":"1","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"88b6c951-1511-4732-ab75-4d585a330c43","keyword":"<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>粉末","originalKeyword":"SnAgCu合金粉末"},{"id":"2bb44e66-01e1-4147-b659-efc6ab5aa5ad","keyword":"真空蒸镀","originalKeyword":"真空蒸镀"},{"id":"3e84b1d3-0ca7-41d0-ba1f-c4c95464aac1","keyword":"蒸镀条件","originalKeyword":"蒸镀条件"}],"language":"zh","publisherId":"gncl201001043","title":"真空蒸镀硬脂酸包覆<span style=\"color:red\">SnAgCu</span>无铅焊料<span style=\"color:red\">合金</span>粉末研究","volume":"41","year":"2010"},{"abstractinfo":"利用JSM-5610LV扫描电镜（SEM）及能谱分析（EDS）等测量方法,研究了微量RE对Sn-2.5Ag-0.7Cu无铅钎料的显微组织、润湿特性、拉伸强度及焊点剪切强度和蠕变断裂寿命的影响。结果表明,向Sn-2.5Ag-0.7Cu中添加0.1%RE可明显细化钎料<span style=\"color:red\">合金</span>的显微组织,改善钎料<span style=\"color:red\">合金</span>的润湿特性,提高钎料<span style=\"color:red\">合金</span>的抗拉强度、伸长率及焊点剪切强度,增加焊点的蠕变断裂寿命。当RE添加量为0.5%时,由于形成了RE化合物而明显恶化钎料<span style=\"color:red\">合金</span>的性能。","authors":[{"authorName":"王要利","id":"c488130f-4349-411c-accd-43a8b9232a56","originalAuthorName":"王要利"},{"authorName":"张柯柯","id":"2ac37a3d-ca38-44c6-b320-37cc74129078","originalAuthorName":"张柯柯"},{"authorName":"李臣阳","id":"4e605302-6289-409b-b855-f72bf369ada6","originalAuthorName":"李臣阳"},{"authorName":"衡中皓","id":"fb1b9b10-e6f6-4e92-b8d7-742db0a4c0c2","originalAuthorName":"衡中皓"}],"doi":"","fpage":"34","id":"fe3f4dfa-4287-40b4-aae4-5d5f1d1a00d1","issue":"12","journal":{"abbrevTitle":"CLRCLXB","coverImgSrc":"journal/img/cover/CLRCLXB.jpg","id":"15","issnPpub":"1009-6264","publisherId":"CLRCLXB","title":"材料热处理学报"},"keywords":[{"id":"f1730782-ae8c-419c-8722-a0d995c1338f","keyword":"Sn2.5Ag0.7CuxRE钎料<span style=\"color:red\">合金</span>","originalKeyword":"Sn2.5Ag0.7CuxRE钎料合金"},{"id":"3fddff3f-3fa9-4750-ab44-4a5d5ebbd3c4","keyword":"显微组织","originalKeyword":"显微组织"},{"id":"efe13c7a-690a-4b1b-8334-7e3ef59281a4","keyword":"润湿特性","originalKeyword":"润湿特性"},{"id":"ec99efdd-6f9d-4f03-96e6-2cb5132f679a","keyword":"强度","originalKeyword":"强度"},{"id":"d2bb410e-2cbf-48c9-af3f-0a77261612c4","keyword":"蠕变断裂寿命","originalKeyword":"蠕变断裂寿命"}],"language":"zh","publisherId":"jsrclxb201112008","title":"RE对<span style=\"color:red\">SnAgCu</span>钎料<span style=\"color:red\">合金</span>及焊点性能的影响","volume":"32","year":"2011"},{"abstractinfo":"研究了稀土Ce对Sn-3.0Ag-0.5Cu<span style=\"color:red\">合金</span>显微组织及焊点剪切强度的影响规律.利用扫描电镜对铸态<span style=\"color:red\">合金</span>及焊点显微组织和断口形貌进行了观察和分析,利用能谱仪对铸态<span style=\"color:red\">合金</span>组分进行测试,采用力学试验机测试焊点的剪切强度.研究表明：当Ce添加量为0.25%时,铸态<span style=\"color:red\">合金</span>显微组织中β-Sn相与Ag3Sn相明显细化,出现了少量的Sn-Ce相及Ce的偏聚区;采用气雾化粉末所配制的焊膏进行回流焊,添加Ce后,焊点基体组织比未添加时明显优化;经过气雾化制粉,Ce向粉末表面富集并极易氧化,导致焊粉氧含量升高,使得回流焊接后焊料/Cu界面IMC层附近孔洞增加,焊点剪切强度降低.","authors":[{"authorName":"刘文胜","id":"230b17a3-1ae5-475c-a860-9c7dec4cd875","originalAuthorName":"刘文胜"},{"authorName":"罗莉","id":"a6b8502f-1f19-4392-95c3-1ba3d263743d","originalAuthorName":"罗莉"},{"authorName":"马运柱","id":"49f27e90-8984-4a7c-a2ec-326e05e84d89","originalAuthorName":"马运柱"},{"authorName":"彭芬","id":"c0899a80-8455-4349-912a-ac927efc813b","originalAuthorName":"彭芬"},{"authorName":"黄国基","id":"881311f8-fe02-475d-b96a-f35856457240","originalAuthorName":"黄国基"}],"doi":"","fpage":"115","id":"5e30ea9e-42dd-4637-9ab3-bd36b16a1483","issue":"6","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"02c3578b-79de-42f1-94c4-3a530e1f4b44","keyword":"<span style=\"color:red\">SnAgCu</span>焊料","originalKeyword":"SnAgCu焊料"},{"id":"de050be9-5fdf-4472-b83f-e2c76d55c0af","keyword":"稀土Ce","originalKeyword":"稀土Ce"},{"id":"d1064460-f845-48d1-bbad-2fb0d728da9f","keyword":"显微组织","originalKeyword":"显微组织"},{"id":"14b023f4-78a1-402f-87a3-baaf2f26ec1c","keyword":"剪切强度","originalKeyword":"剪切强度"},{"id":"dd60572f-ea29-4cab-9c65-a492ae41fbfd","keyword":"气雾化","originalKeyword":"气雾化"}],"language":"zh","publisherId":"clkxygy201206021","title":"稀土Ce对<span style=\"color:red\">SnAgCu</span><span style=\"color:red\">合金</span>显微组织及剪切强度的影响","volume":"20","year":"2012"},{"abstractinfo":"<span style=\"color:red\">SnAgCu</span>钎料广泛应用在电子组装领域,被认为是传统SnPb钎料的最佳替代品.但与Sn63Pb37钎料相比,<span style=\"color:red\">SnAgCu</span>钎料抗氧化能力差,钎料内部及焊点界面存在脆性金属间化合物块及服役期间焊点抗蠕变、疲劳性能较低.添加<span style=\"color:red\">合金</span>元素和纳米颗粒可以显著改善<span style=\"color:red\">SnAgCu</span>钎料的组织和性能,提高焊点可靠性.这对发展新型高性能无铅钎料是一个行之有效的办法.本文结合国内外<span style=\"color:red\">SnAgCu</span>系无铅钎料的最新研究成果,全面阐述了<span style=\"color:red\">合金</span>元素和纳米颗粒等因素对钎料的润湿性、抗氧化性以及焊点显微组织和可靠性的影响,指明了该钎料目前研究中存在的问题及今后的研究方向.","authors":[{"authorName":"陈建勋","id":"53a05bdd-dca5-42f3-925d-7137e700ae88","originalAuthorName":"陈建勋"},{"authorName":"赵兴科","id":"49eed178-cbce-4140-bca0-322623a55bbb","originalAuthorName":"赵兴科"},{"authorName":"刘大勇","id":"4335aa8c-dfcb-48d4-b5f0-33ba822d4b34","originalAuthorName":"刘大勇"},{"authorName":"黄继华","id":"6f8ae779-1348-4c33-b5aa-974b15988987","originalAuthorName":"黄继华"},{"authorName":"邹旭晨","id":"7b9e7c93-c03d-46c1-a477-2ccddaeae9fd","originalAuthorName":"邹旭晨"}],"doi":"10.3969/j.issn.1001-4381.2013.09.018","fpage":"91","id":"846730d0-4f79-40ca-9154-9b893d763d95","issue":"9","journal":{"abbrevTitle":"CLGC","coverImgSrc":"journal/img/cover/CLGC.jpg","id":"9","issnPpub":"1001-4381","publisherId":"CLGC","title":"材料工程"},"keywords":[{"id":"1b2944e9-3932-4ad7-9184-6c01654c7439","keyword":"无铅钎料","originalKeyword":"无铅钎料"},{"id":"4c915ac2-15c7-473d-a08b-7357eabb9cbd","keyword":"<span style=\"color:red\">SnAgCu</span>系","originalKeyword":"SnAgCu系"},{"id":"ed8f98d7-7878-42cc-b402-04a337d8b04d","keyword":"可靠性","originalKeyword":"可靠性"},{"id":"22ef2427-489f-4788-84bd-8db178bb9a7c","keyword":"评述","originalKeyword":"评述"}],"language":"zh","publisherId":"clgc201309018","title":"电子组装用<span style=\"color:red\">SnAgCu</span>系无铅钎料的研究进展","volume":"","year":"2013"}],"totalpage":3884,"totalrecord":38831}