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刊期: 语种: 英文

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Tin Whisker Growth on NdSn(3) Powder

Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys

Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples

Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

Oxidation behavior of molten tin doped with phosphorus

Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

Weakening of the Cu/Cu(3)Sn(100) Interface by Bi Impurities

Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates

Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints

Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate

Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface

Current-induced phase partitioning in eutectic indium-tin pb-free solder interconnect

Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints

Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

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Journal of Electronic Materials

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Journal of Electronic Materials

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Journal of Electronic Materials

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Journal of Electronic Materials

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