对(Ba1-xPbx)TiO3基PTCR热敏元件进行的热疲劳研究发现:元件的热疲劳特征与热循环温度以及材料的居里温度密切相关.当热循环温度低于材料的居里温度时,元件的室温电阻率随热循环次数的增加而增加;但当热循环温度高于材料的居里点时,元件的室温电阻率在初始热循环阶段出现负增长现象,然后才随循环次数的增加而增加.对不同温度下的热疲劳机理进行了探讨,并提出Bi是提高(Ba1-xPbx)TiO3系热敏元件性能稳定性较为理想的掺杂元素.
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