系统介绍了锡-锌合金电镀工艺的研究进展,综述了焦磷酸盐、葡萄糖酸盐、柠檬酸盐、酒石酸盐等不同体系的镀液配方及操作化规范,总结了溶液组成、阴极电流密度、温度、pH等工艺参数对镀层成分的影响规律,提出了目前研究中存在的问题,并展望了电镀工艺未来的发展趋势.
参考文献
[1] | Taguchi AD;Bento FR;Mascaro LH .Nucleation and growth of tin-zinc electrodeposits on a polycrystalline platinum electrode in tartaric acid[J].Journal of the Brazilian Chemical Society,2008(4):727-733. |
[2] | Susumu Arai;Hideki Akatsuka;Norio Kaneko .Sn-Ag Solder Bump Formation for Flip-Chip Bonding by Electroplating[J].Journal of the Electrochemical Society,2003(10):C730-C734. |
[3] | Jimenez H;Gil L;Staia MH;Puchi-Cabrera ES .Effect of deposition parameters on adhesion, hardness and wear resistance of Sn-Ni electrolytic coatings[J].Surface & Coatings Technology,2008(10):2072-2079. |
[4] | Motohiro Yuasa;Kota Kajikawa;Masataka Hakamada;Mamoru Mabuchi .A superelastic nanocrystalline Cu-Sn alloy thin film processed by electroplating[J].Materials Letters,2008(29):4473-4475. |
[5] | Suh MS;Park CJ;Kwon HS .Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath[J].Surface & Coatings Technology,2006(11):3527-3532. |
[6] | Kohl P A .The high speed electrodeposition of Sn/Pb alloys[J].Journal of the Electrochemical Society,1982,129(06):1196. |
[7] | Shuji Igarashi;Yoshikazu Fujisawa;Toshio Igarashi .Electroplating bath for tin or tin alloy with brightness[P].US,4168223,1979-09-18. |
[8] | Teichmann R J;Mayer L J .Electroplating tin and tin alloys and baths therefor[P].US,4347107,1982-08-31. |
[9] | Mccoy E H .Alkaline plating baths and electroplating process[P].US,489286,1983-06-21. |
[10] | Shimetomo Fueki;Junichi Tada;Kenji Osawa et al.Baths for the electroplating of tin-cobalt[P].US,4021316,1977-05-03. |
[11] | 方景礼.电镀配合物理论与应用[M].北京:化学工业出版社,2008:546. |
[12] | Edward Budman;Michael McCoy .Tin-Zinc Plating[J].Metal finishing,1995(9):10-11,14-15-0. |
[13] | David Crotty .Zinc Alloy Plating for the Automotive Industry[J].Metal finishing,1996(9):54,56-58-0. |
[14] | Wilcox G D;Gabe D R .Electrodeposited zinc alloy coatings[J].Corrosion Science,1993,35(5-8):1251. |
[15] | Dubenta S;Mertensb M L A D;Saurata M .Electrodeposition,characterization and corrosion behaviour of tin20wt.% zinc coatings electroplated from a non-cyanide alkaline bath[J].Materials Chemistry and Physics,2010,120(2-3):371. |
[16] | Ashiru OA.;Shirokoff J. .ELECTRODEPOSITION AND CHARACTERIZATION OF TIN-ZINC ALLOY COATINGS[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,1996(2):159-169. |
[17] | 丁志强,陈红星,齐慧滨.燃油箱用无铅表面处理钢板材料的发展[J].表面技术,2006(01):5-8. |
[18] | 陈文华,王玲.Sn-Zn镀层钎焊性研究[J].材料保护,1999(01):29. |
[19] | 蔡积庆.化学镀Sn-Zn合金[J].电镀与环保,2001(02):27-29. |
[20] | Kyoo Young Kim;Boo Young Yang .An electrochemical study on Zn-Sn-alloy-coated steel sheets deposited by vacuum evaporation.Part Ⅰ[J].Surface and Coatings Technology,1994,64(02):99. |
[21] | Wang K;Pickering H W;Weil K G .EQCM studies of the electrodeposition and corrosion of tin-zinc coatings[J].Electrochimica Acta,2001,46(24-25):3835. |
[22] | Perez-Blanco JM;Barber GD .Ambient atmosphere bonding of titanium foil to a transparent conductive oxide and anodic growth of titanium dioxide nanotubes[J].Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion,2008(9):997-1002. |
[23] | Hitoshi Sakurai;Tadahiro Ohnuma .Tin-zinc alloy electroplating bath method for electroplating using the same[P].US,5618402,1997-04-08. |
[24] | Guaus E;Torrent-Burgués J .Tin-zinc electrodeposition from sulphate-gluconate baths[J].Journal of Electroanalytical Chemistry,2003,549(05):25. |
[25] | Chi-Chang Hu;Chun-Kou Wang;Gen-Lan Lee .Composition control of tin-zinc deposits using experimental strategies[J].Electrochimica Acta,2006(18):3692-3698. |
[26] | Chi-Chang Hu;Chun-Kou Wang .Effects of composition and reflowing on the corrosion behavior of Sn-Zn deposits in brine media[J].Electrochimica Acta,2006(20):4125-4134. |
[27] | Kwang-Lung Lin;Li-Min Sun .Electrodeposition of eutectic Sn-Zn alloy by pulse plating[J].Journal of Materials Research,2003(9):2203-2207. |
[28] | 张巧;秦孝慈 .在柠檬酸盐水溶液中电镀锡-锌合金的研究[J].西安交通大学学报,1989,23(05):21. |
[29] | Guaus E;Torrent-Burgues J .Tin-zinc electrodeposition from sulphate-tartrate baths[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2005(2):301-309. |
[30] | Shuji Igarashi;Yoshikazu Fujisawa;Toshio Igarashi .Method for stabilizing tin or tin alloy electroplating baths[P].US,4163700,1979-08-07. |
[31] | Aoki Kazuhiro;Obata Keigo;Yoshimoto Masakazu .Neutral bath for bright tin-zinc alloy plating[P].JP,2004359996,2004-12-24. |
[32] | V.S. Vasantha;Malathy Pushpavanam;V.S. Muralidharan .A Noncyanide Bath for the Electrodeposition of Tin-Zinc Alloys[J].Metal finishing,1996(11):60,62-63-0. |
[33] | Vitkova St;Ivanova V;Raichevsky G .Electrodeposition of low tin content zinc-tin alloys[J].Surface and Coatings Technology,1996,82(03):226. |
[34] | 徐加民,安茂忠,苏彩娜,杨培霞.离子液体金属电沉积研究进展[J].电镀与环保,2009(02):1-6. |
[35] | Abbott AP;Capper G;McKenzie KJ;Ryder KS .Electrodeposition of zinc-tin alloys from deep eutectic solvents based on choline chloride[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2007(2):288-294. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%