采用含Ti的铜合金及无压反应浸渗工艺制备C/Cu复合材料,利用XRD,SEM和EDS等检测手段分析研究试样的显微组织,讨论浸渗过程中的界面反应.结果表明:在铜基体中加入强碳化物形成元素Ti,可提高铜及铜合金与碳的自发润湿性,使无压浸渗工艺制备C/Cu复合材料成为可能;复合材料中的主相为Cu、C和TiC,TiC以溶解析出的形式形成于碳纤维周围,合金中的Ti含量决定复合材料中TiC的含量,适量Ti可降低系统的润湿角并有利于浸渗进行,但Ti过量将对纤维造成损伤,使复合材料中碳纤维的体积分数下降.
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