通过高能球磨和真空热压技术制备了致密度大于98%的纳米晶CuCr合金,通过XRD,SEM和TEM研究了其显微组织和结构.结果表明,其晶粒尺寸小于50 nm.在模拟电路上研究了其真空电弧稳定性和截流值,纳米晶CuCr合金的真空电弧稳定性好于常规CuCr合金,其截流值为常规CuCr合金的17%~35%.
参考文献
[1] | Boxman R.L.;Goldsmith S. .Twenty-five years of progress in vacuum arc research and utilization[J].IEEE Transactions on Plasma Science,1997(6):1174-1186. |
[2] | Beilis I I .[J].IEEE Transactions on Plasma Science,2001,29(05):657. |
[3] | Boxman R L .[J].IEEE Transactions on Plasma Science,2001,29(05):759. |
[4] | 徐国政.高压短路器原理和应用[M].北京:清华大学出版社,2000 |
[5] | Peter R;Smeet P .[J].IEEE Transactions on Plasma Science,1989,17(02):303. |
[6] | Slade P G .[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1994,17(01):96. |
[7] | Rieder W F;Schussek M;Glaitzle W;Kny E .[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1989,12(02):273. |
[8] | 王亚平.选择相强化及组织超细化对CuCr触头材料电性能的影响[M].西安:西安大学出版社,1998 |
[9] | ZHAO Feng,XU Hui,YANG Zhi-mao,DING Bing-jun.Preparation of CuCr25 alloys through vacuum arc-smelting and their properties[J].中国有色金属学会会刊,2000(01):73. |
[10] | 王江,张程煜,丁秉钧.加入Ni-Al,W-Ni,W-Co二元添加剂时的CuCr25合金的组织与性能[J].稀有金属材料与工程,2001(04):290-294. |
[11] | Yamamoto A.;Okutomi T. .Instability of vacuum arc in Ag-Cu contact alloys[J].IEEE Transactions on Plasma Science,1993(5):463-468. |
[12] | 严群,杨志懋,王秉钧,王笑天.真空触头材料显微组织对饱和蒸气压及截流值的影响[J].高压电器,1995(06):28. |
[13] | 张立德;牟季美.纳米材料和纳米结构[M].北京:科学出版社,2001 |
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