染料敏化太阳能电池(Dye-sensitized solar cells,DSSC)作为第3代太阳能电池而受到广泛关注,但使用寿命短一直是制约DSSC进入实用阶段的主要因素之一.液态电解质的DSSC往往因为电解质挥发或渗漏而失效,因此封装工艺成为保障此类DSSC性能稳定和持久的重要手段.将DSSC相关技术中的封装环节独立出来,简述了近几年来DSSC封装工艺的进展.主要对小面积DSSC、大面积DSSC模块(包括柔性DSSC、可填充DSSC)和管状DSSC的封装材料和流程以及几种DSSC的性能特点进行阐述,对封装技术的发展方向以及应用提出了一些看法.
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