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K-cor是应用Z-pin增强技术的一种新型高性能结构.本文以NHZP-1树脂为基体研究适合K-cor结构的半固化Z-pin拉挤工艺,得到固化度为51.25%的Z-pin为满足制备要求的最佳参数,并制作悬空装置采用两步法进行半固化Z-pin的植入和压弯,探索出压弯和后固化工艺.在此基础上,对试制的K-cor夹层结构进行平拉和剪切试验研究.结果发现,折弯长度是K-cor夹层结构的另一重要参数,较长的折弯长度会增加Z-pin与蒙皮的结合面积从而提高结构的拉伸性能.

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