欢迎登录材料期刊网

材料期刊网

高级检索

Ta2O5薄膜层具有较高的介电常数、折射率以及和ULSI加工过程中的相容性,因而将在硅芯片栅层材料、动态随机存储器、减反膜、气敏传感器、太阳能光伏电池面板介电层等方面得到应用.对以Ta(OC2H5)5为原料,通过常规金属有机化合物气相沉积、光致化学气相沉积、等离子增强化学气相沉积、原子层化学气相沉积和脉冲化学气相沉积法制各Ta2O5薄膜进行了评述,并对这些方法存在的问题进行了分析.

参考文献

[1] Muller D A et al.[J].Nature,1999,399:758.
[2] Ranuarez J C;Deen M J;Chen Chill-Hung .[J].Microelectronics Reliability,2006,46(12):1939.
[3] Max Schulz .[J].Nature,1999,399:729.
[4] Kingon Angus I et al.[J].Nature,2000,406:1032.
[5] van Dover R B et al.[J].Nature,1998,392:162.
[6] Cava R F et al.[J].Nature,1995,377:215.
[7] CHANDRA S. DESU;POORAN C. JOSHI;SESHU B. DESU .The Enhanced Dielectric and Insulating Properties of Al{sub}2O{sub}3 Modified Ta{sub}2O{sub}5 Thin Films[J].Journal of electroceramics,2003(3):209-214.
[8] Ozer C;Lampert M .[J].Journal of Sol-Gel Science and Technology,1997,8(1-3):703.
[9] Shimizu K.;Thompson GE.;Skeldon P.;Wood GC.;Kobayashi K. .THE MIGRATION OF FLUORIDE IONS IN GROWING ANODIC OXIDE FILMS ON TANTALUM[J].Journal of the Electrochemical Society,1997(2):418-423.
[10] Babeva Tz;Atanassova E;Koprinarova J .[J].Physical Status Solidi A Applied Research,2005,202(02):330.
[11] Zhana Todorova;Nikolay Donkov;Zoran Ristic;Nenad Bundaleski;Suzana Petrovic;Mario Petkov .Electrical and Optical Characteristics of Ta_2O_5 Thin Films Deposited by Electron-Beam Vapor Deposition[J].Plasma processes and polymers,2006(2):174-178.
[12] Cheng-Chung Lee;Der-Jun Jan .Optical properties and deposition rate of sputtered Ta_2O_5 films deposited by ion-beam oxidation[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2005(1/2):130-135.
[13] Luo E Z et al.[J].Journal of Vacuum Science and Technology,1999,17(06):32-35.
[14] Kaupo Kukli;Katarina Forsgren;Anders Harsta;Hugo mandar;Alma-Asta Kiisler .Atomic layer depostition of tantalum oxide thin films from iodide precursor[J].Chemistry of Materials,2001(1):122-128.
[15] Tanimoto S et al.[J].Journal of the Electrochemical Society,1992,139(01):320.
[16] Hiroyuki Koyama et al.[J].Japanese Journal of Applied Physics Part 1:Regular Papers and Short Notes and Review Papers,1994,33(11):6291.
[17] Mansevit H M .[J].Applied Physics Letters,1968,156:12.
[18] Kaupo Kukli et al.[J].Journal of the Electrochemical Society,1995,142(05):1670.
[19] Treichel H;Mitwalsky A;Sandier N P et al.[J].Advanced Materials for Optics & Electronics,1992,1(06):299.
[20] McKinley K A et al.[J].Thin Solid Films,1996,290-291:440.
[21] Aoyama T.;Okayama Y.;Fujisaki M.;Imai K.;Arikado T.;Saida S. .LEAKAGE CURRENT MECHANISM OF AMORPHOUS AND POLYCRYSTALLINE TA2O5 FILMS GROWN BY CHEMICAL VAPOR DEPOSITION[J].Journal of the Electrochemical Society,1996(3):977-983.
[22] Hiroshi Shinriki et al.[J].Journal of the Electrochemical Society,1998,145(09):3247.
[23] Seshu B Desu .[J].Materials Chemistry and Physics,1992,31(04):341.
[24] Wanxue Zeng et al.[J].Journal of the Electrochemical Society,2004,151(08):172.
[25] Sukanya Murali;Anand Deshpande;Christos G.Takoudis .Modeling of the Metalorganic Chemical Vapor Deposition of Tantalum Oxide from Tantalum Ethoxide and Oxygen[J].Industrial & Engineering Chemistry Research,2005(16):6387-6392.
[26] Ian W. Boyd;Jun-Ying Zhang .Photo-induced growth of dielectrics with excimer lamps[J].Solid-State Electronics,2001(8):1413-1431.
[27] Jun-Ying Zhang et al.[J].Journal of Physics D:Applied Physics,1999,32(19):91.
[28] Jun-Ying Zhang et al.[J].Applied Surface Science,2000,154-155:382.
[29] Fang Q.;Zhang JY.;Wang ZM.;Wu JX.;O'Sullivan BJ.;Hurley PK.;Leedham TL.;Davies H.;Audier MA.;Jimenez C.;Senateur JP.;Boyd IW. .Interface of tantalum oxide films on silicon by UV annealing at low temperature[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2003(1/2):248-252.
[30] Ian W. Boyd;Jun-Ying Zhang .Low temperature photoformation of tantalum oxide[J].Microelectronics and reliability,2000(4/5):649-655.
[31] Jun-Ying Zhang et al.[J].Applied Surface Science,2000,168(1-4):312.
[32] Prakash P Murawala;Mikio Sawai;Toshiaki Tatsuta et al.[J].Japanese Journal of Applied Physics,1993,32(1B):368.
[33] Mort J;Jansen F.Plasma Deposited Thin Film[M].Boca Raton:crc Press,1986:23.
[34] Chatterjee S.;Samanta SK.;Maiti CK. .Structural characterization and effects of annealing on the electrical properties of stacked SiOxNy/Ta2O5 ultrathin films on strained-Si0.82Ge0.18 substrates[J].Journal of Physics, D. Applied Physics: A Europhysics Journal,2003(7):901-907.
[35] Chatterjeel S et al.[J].Semicond Sci Teehnol,2002,17(09):993.
[36] Chaneliere C;Autran J L;Devine R A B et al.[J].Materials Science and Engineering,1998,22(06):269.
[37] Mukhopadhyay M et al.[J].Iete Journal of Research,1997,43(01):55.
[38] Szymanowski H et al.[J].Journal of Vacuum Science and Technology A-Vacuum Surfaces and Films,2005,23(02):241.
[39] Masse JP;Szymanowski H;Zabeida O;Amassian A;Klemberg-Sapieha JE;Martinu L .Stability and effect of annealing on the optical properties of plasma-deposited Ta2O5 and Nb2O5 films[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(4):1674-1682.
[40] Kaupo Kukli et al.[J].Journal of the Electrochemical Society,1995,142(05):1670.
[41] Kauo Kukli et al.[J].Applied Surface Science,1997,112:236.
[42] Antti Rahtu;Kaupo Kukli;Mikko Ritala .In situ mass spectrometry studyon atomic layer deposition from metal (Ti,Ta,and Nb)Ethoxides and Water[J].Chemistry of Materials,2001(3):817-823.
[43] Aarik J et al.[J].Journal of Materials Chemistry,1994,4:1239.
[44] Petra A16n et al.[J].Journal of the Electrochemical Society,2006,153(04):304.
[45] Kaupo Kukli et al.[J].Journal of the Electrochemical Society,1997,144(01):300.
[46] Mikko Ritala et al.[J].Science,2000,288(5464):319.
[47] Kukli K et al.[J].Chemistry of Materials,2000,12(07):1914.
[48] Porporati A;Roitti S;Sabizero O .[J].Journal of the European Ceramic Society,2003,23(02):247.
[49] Susan P Krumdieck;Rishi Raj .[J].Chemical Vapor Deposition,2001,7(02):85.
[50] Jun Lin et al.[J].Applied Physics Letters,2006,8(06):62902.
[51] Burte E P;Rausch N .[J].Journal of Non-Crystalline Solids,1995,187:425.
[52] Lee J S et al.[J].Materials Chemistry and Physics,2002,77:242.
[53] Yu JJ.;Zhang JY.;Boyd IW. .UV annealing of ultrathin tantalum oxide films[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2002(1/4):57-63.
[54] Liu C H;Chang S J;Chen J F et al.[J].Materials Science and Engineering B,2004,106(03):234.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%