BGA用焊球制造技术新进展

稀有金属材料与工程, 2007, 36(z3): 543-546.

BGA用焊球制造技术新进展

于洋 ^1, , 史耀武 ^2, , 夏志东 ^3, , 雷永平 ^4, , 郭福 ^5, , 李晓延 ^6, , 陈树君 ^7,

1.北京工业大学,北京,100022

2.北京工业大学,北京,100022

3.北京工业大学,北京,100022

4.北京工业大学,北京,100022

5.北京工业大学,北京,100022

6.北京工业大学,北京,100022

7.北京工业大学,北京,100022

基金项目: 国家高技术研究发展计划(863计划)(2002AA322040)

关键词：微焊球 , BGA , 射流断裂

New Progress in Manufacturing Technology of Metallic Microspheres

综述了近年来国内外BGA封装用微焊球制造技术的发展动态.介绍了射流断裂技术的成球原理及其生产装置演变情况.简述了基于均匀射流断裂技术的液滴制造技术的各种应用及其优点.最后简述了国内外生产电子封装用微焊球的情况.

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BGA用焊球制造技术新进展

New Progress in Manufacturing Technology of Metallic Microspheres

参考文献