欢迎登录材料期刊网

材料期刊网

高级检索

为研究微、纳米氧化铝无机颗粒对环氧树脂导热性能和电性能的影响,制备出了不同含量微/纳米氧化铝/环氧树脂复合材料。结果表明:纳米氧化铝提高了环氧树脂的击穿强度,而微米氧化铝则降低了击穿强度。环氧树脂的热导率随着氧化铝含量的增加而增大,纳米氧化铝因氧化铝颗粒与环氧树脂之间的高热阻而对环氧树脂热导率影响相对较小。

参考文献

[1] J. W. Wan;W. J. Zhang;D. J. Bergstrom .An Analytical Model for Predicting the Underfill Flow Characteristics in Flip-Chip Encapsulation[J].IEEE transactions on advanced packaging,2005(3):481-487.
[2] Peterfish W G;Noddin D B;Hanson D A.High Density Organic Flip Chip Substrate Technology[A].,1998:1089-1097.
[3] Ishida H.;Rimdusit S. .Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,1998(1/2):177-186.
[4] Bae J;Kim W;Cho S et al.The Properties of AlN-filled Epoxy Modeling Compounds by the Effects of Filler Size Distribution[J].Journal of Materials Science,2000,35(23):5907-5913.
[5] Simon Konzelmann;Christian Hoffmann;Ralf Merte;Dirk Peier .Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound[J].IEEE Transactions on Dielectrics and Electrical Insulation,2008(2):327-333.
[6] 王聪.环氧树脂/氧化铝导热复合材料的结构设计和制备[J].绝缘材料,2010(01):52-55.
[7] Bruggeman D A G .Berechnung Verschiedener Physikalisher Konstanten Von Heterogenen Substanzen[J].ANNALEN DER PHYSIK,1935,24(07):636-664.
[8] Li Z;Okamoto K;Ohki Y.Role of Nano-filler on Partial Discharge Resistance and Dielectric Breakdown Strength of Micro-Al2O3/Epoxy Composites[A].,2009:735-756.
[9] Nelson J K;Hu Y.Electrical Properties of TiO2 Nanocom-posites[A].,2003:719-722.
[10] Parker W J;Jenkins R J;Butler C P et al.Flash Method of Determining Thermal Diffusivity,Heat Capacity and Thermal Conductivity[J].Journal of Applied Physicals,1961,32(09):1679-1684.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%