本文利用扫描电镜X射线能谱及X射线光谱分析,结合金相及试样逐层的X射线结构分析,剖析了Cu-Ti合金与石墨(或金刚石)粘结界面的微区组织结构;揭示了Cu-Ti合金对金刚石表面的浸润和粘结机理。即Cu-Ti合金中的Ti原子与石墨(或金刚石)表面的碳原子在高温下反应生成稳定的断续的TiC膜,Cu-Ti合金对金刚石的浸润和粘结是通过TiC来实现的。
The structure of micro-region along the interfacial section between Cu-Ti alloy and graphite (or diamond) has been analyzed by using SEM-EDS and SEMWDS as well as in-depth metallography and X-ray diffraction. It was revealed that the wetting and bonding behaviour on diamond surface by Cu-Ti melt is realized through the stable TiC film which is produced by interaction between Ti atoms of Cu-Ti alloy and C atoms of graphite (or diamond) surface at elevated temperatures.
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