在玻璃基底上溅射Ti或Cr／Cu种子层，并对Ti基板表面进行预处理．研究基底表面粗糙度、热处理温度对于Ni微结构镀层结合强度的影响。结果表明，基底表面粗糙度、热处理温度对Ni微结构镀层与基底的结合强度有较大影响，经过200℃的热处理，溅射Ti及Cr／Cu种子层与Ni微结构的结合强度提高近1倍。通过EC-SPM、SEM等分析手段，初步探讨了结合强度的影响机制。
Titanium or Cr/Cu seeding layer was deposited by Ti substrate were treated with some chemical regent before heat treatment temperature and the surface roughness on the RF sputtering on glass substrate. The surfaces of electroplating of Ni microstructure. The effect of bonding strength of Ni microstructure was investigated on different substrate. The results showed that the bonding strength of Ni microstructure are greatly influenced by the surface roughness and heat treatment temperature. After heat treatment at 200℃, the strength was doubled compared with that without heat treatment. Furthermore, the microstructure of bonding e cross section of the sample was investigated using EC-SPM and SEM. The factors which affected the bonding strength of Ni microstructure were discussed.
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