为了解铁的电结晶机理及润湿剂十二烷基硫酸钠(SDS)对铁电沉积阴极过程的影响，采用线性扫描伏安法、单电位阶跃计时电流法、交流阻抗谱等手段对由200 g/L FeSO4·7H2O、20 g/L H3BO3、50 g/L MnCl2和30 g/L配位剂组成的基础镀液和含0.2 g/L SDS的镀铁溶液中铁在玻碳电极上的电沉积行为进行了对比研究。结果表明，润湿剂的加入使铁电沉积的阴极极化增强。不管镀液中是否含有润湿剂，铁在玻碳电极上的电结晶都遵循三维瞬时成核理论，且在含有润湿剂的镀液中的结晶过程与理论模型有着更好的吻合程度。润湿剂的加入使反应物离子的扩散受阻，电荷传递电阻增大。这些变化可能与SDS在镀层表面的吸附和对表面张力的影响有关。
The electrodeposition behaviors of iron on glassy carbon electrode from the bath composed of FeSO4·7H2O 200 g/L, H3BO3 20 g/L, MnCl2 50 g/L, and complexing agent 30 g/L with and without 0.2 g/L sodium dodecyl sulfate (SDS) as wetting agent were comparatively studied by linear sweep voltammetry, single potential step chronoamperometry, and alternating current impedance spectroscopy to explore the mechanism of iron electrocrystallization and the influence of SDS on cathodic process of iron electrodeposition. The results showed that the cathodic polarization of iron electrodeposition is enhanced as a result of the addition of wetting agent. The electrocrystallization of iron on glassy carbon electrode follows the three-dimensional instantaneous nucleation theory no matter the plating bath contains wetting agent or not. The iron electrocrystallization in bath containing wetting agent is more consistent with the theoretical model. The diffusion of reactant ions is hindered due to the addition of wetting agent, resulting in an increase of charge transfer resistance. All of the above changes may have something with the adsorption of SDS and its effect on surface tension.
参考文献
| [1] | 李庆伦;于晓中;汪红 等.低温镀铁技术的发展[J].电镀与涂饰,1998,17(4):41-43. |
| [2] | 孙凯,杨森,安宁.低温镀铁技术的发展与应用[J].电镀与环保,2011(05):1-3. |
| [3] | 田永常,杨展.直流电镀铁基胎体性能及其金刚石钻头研究[J].金刚石与磨料磨具工程,2009(03):24-27. |
| [4] | 刘洪涛,顾卡丽,李健,杜三明.低温镀铁层的微观结构和摩擦学性能[J].材料保护,2004(06):7-8. |
| [5] | 伍涛,潘秉锁,田永常.低温镀铁电流密度对镀层组织形貌、组构与硬度的影响[J].材料保护,2012(12):27-29. |
| [6] | Darko Grujicic;Batric Pesic .Iron nucleation mechanisms on vitreous carbon during electrodeposition from sulfate and chloride solutions[J].Electrochimica Acta,2005(22):4405-4418. |
| [7] | GóMEZ E;MüLLER C;POLLINA R et al.Studies of electrodeposition of nickel:different nickel(II)and sulphonated additive concentrations[J].Journal of Electroanalytical Chemistry,1992,333(1/2):47-64. |
| [8] | 刘宇,谭澄宇,贾志强,胡炜.铜离子对镍在玻碳电极上电结晶行为的影响[J].中南大学学报（自然科学版）,2010(01):144-149. |
| [9] | 潘秉锁,牛明远,方小红.镍锰合金的电沉积行为[J].材料保护,2009(10):1-3. |
| [10] | 陈立佳;康煜平;冯浩然 等.低温直流镀铁液中的添加剂[J].材料保护,1997,30(3):25-27. |
| [11] | 方小红 .超声波电镀镍基金刚石钻头工艺与机理研究[D].中国地质大学(武汉),2008. |
| [12] | 冯立明.电镀工艺与设备[M].北京:化学工业出版社,2005:2. |
| [13] | 郑利峰,郑国渠,曹华珍,张九渊.氨络合物体系中镍在玻璃碳上的电化学成核机理[J].材料科学与工程学报,2003(06):882-885. |
| [14] | 袁国伟.电化学阻抗谱在电沉积研究中的应用（一）[J].电镀与涂饰,2008(01):1-4. |
| [15] | 田昭武.电化学研究方法[M].北京:科学出版社,1984:274-276. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%