研究了添加剂硫脲(TU)对低温碱性化学镀镍的镀速和镀层质量的影响.结果表明,随着硫脲加入量增大,化学镀镍速率先减小后增大,其适宜加入量为1 mg/L;硫脲对H+的还原具有抑制作用而对镀层组成影响很小.它的添加使镀层晶粒更为细致均匀,镀层更平滑,孔隙率更低；镀层以Ni为主并含少许Ni5P4,硫脲使Ni结晶峰得到增强.少量的硫脲会促进极化进而减缓镍的沉积,但加入量增加时,则增加去极化效应而加速镍的沉积.
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