Self-assembled (SA) films of Schiff base were prepared on the copper surface. The corrosion protection abilities of SA films in chloride solution were evaluated using electrochemical impedance spectroscopy and polarization curves. A subsequent adsorption of 1-dodecanethiol on the original SA films of Schiff base improved significantly the protection ability to the copper substrate. The behavior of Schiff base adsorption on copper surface and subsequent adsorption of 1-dodecanethiol was probed by X-ray photoelectron spectroscopy. It was found that copper exists mainly in Cu(I) state in the SA films of Schiff base, and the thiol molecules subsequently adsorbed was bonded directly on copper surface rather than physisorbed on the previous SA films. (C) 2002 Elsevier Science Ltd. All rights reserved.
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