扩散连接是一种在固态下将2个同种或异种的材料连接在一起的先进连接方法.这种方法既可以连接低碳钢,也可以连接陶瓷,甚至还可以连接传统焊接方法所不能连接的材料.在很多材料没有实验数据的条件下,预测扩散连接所需时间是非常重要也是非常困难的,因此利用空洞闭合模型对扩散连接过程进行研究是当前固态扩散连接研究的重要方面.介绍了扩散连接空洞闭合的几个典型模型,对几何模型的选择进行了阐述,并对扩散连接的机制进行了解释和说明,同时比较了这几个模型的优缺点,并预测了扩散连接空洞闭合模型的发展方向.
Diffusion bonding is an advanced bonding process in which two materials,similar or dissimilar,can be bonded in solid state.This provides to bond materials in a wide range from low carbon steels to ceramics and com-posites which cannot be bonded with conventional welding methods.The estimation of final bonding time is very im-portant but difficult without experiments for many materials.It is important for the study of diffusion bonding to es-tablish a model of void shrinkage.The typical models of void shrinkage in diffusion bonding are reviewed.A variety of geometric models are overviewed in this paper.The mechanisms of diffusion bonding are explained at the same time.The advantages and disadvantages of these models and the differences among these models are also discussed.
参考文献
| [1] | 于卫新,李淼泉,胡一曲.材料超塑性和超塑成形/扩散连接技术及应用[J].材料导报,2009(11):8-14. |
| [2] | 张九海,何鹏.扩散连接接头行为数值模拟的发展现状[J].焊接学报,2000(04):84-91. |
| [3] | 李志强;郭和平 .超塑成形/扩散连接技术在航空航天工业中的应用[J].锻压技术,2005,30(01):79. |
| [4] | 宋敏霞,赵熹华,郭伟,冯吉才.钛合金与非金属材料扩散连接研究现状与发展[J].焊接,2005(10):9-12. |
| [5] | 黄万群,李亚江,王娟,沈孝芹.陶瓷/金属钎焊与扩散连接的研究现状[J].焊接,2007(04):11-13. |
| [6] | 邹贵生,白海林,谢二虎,吴树甲,吴爱萍,王庆,任家烈.O相合金Ti-22Al-25Nb固态扩散连接[J].中国有色金属学报,2008(04):577-582. |
| [7] | Dupeux M;Chuangeng W et al.Application of binary inter diffusion models to γ'(Ni_3Al)/γ(Ni) diffusion bonded inter-faces[J].ACTA METALLURGICA ET MATERIALIA,1993,41(11):3071. |
| [8] | Takahashi Y et al.Identification of void shrinkage mecha-nisms[J].ACTA METALLURGICA ET MATERIALIA,1993,41(11):3077. |
| [9] | Lefrancois P et al.Solid-state welding of a 0.27 carbon chromium/molybdenum steel[J].Welding Journal,1993,24:313. |
| [10] | 祝汉良;李志强 .Ti_3Al超塑性扩散连接的理论计算[J].材料科学与工艺,1999,7(z1):224. |
| [11] | 王秀锋,林建国,于更生,刘学斌.经激光表面晶粒细化TiAl合金的超塑扩散连接及其数学模拟[J].湘潭大学自然科学学报,2004(04):57-62. |
| [12] | Li S X;Tu S T;Xuan F Z .A probabilistic model for predic-tion of bonding time in diffusion bonding[J].Materials Science and Engineering,2005,A407:250. |
| [13] | Lu X H;Yang Y Q;Luo X et al.Experimental and theo-retical study of diffusion bonding in fabricating Ti matrix composite[J].Materials Science and Engineering,2007,A458:202. |
| [14] | 姚为,吴爱萍,邹贵生,任家烈.塑性变形条件对扩散焊接头性能的影响[J].焊接,2006(10):30-33. |
| [15] | Lu S H;Yun J B .Theoretical model of the transformation superplastic diffusion bonding of eutectoid steel[J].Journal of Materials Processing Technology,2002,129:458. |
| [16] | 陈思杰,井晓天,李辛庚.工艺参数对T91钢管TLP连接组织和性能的影响[J].材料科学与工艺,2006(04):341-344. |
| [17] | 姚为,吴爱萍,邹贵生,任家烈.LF6/TA2扩散焊接接头组织结构及性能[J].焊接学报,2007(12):89-92,96. |
| [18] | 张中元;林兆荣;王文平 等.扩散焊接理论模型[J].航空制造工程,1996,25(05):8. |
| [19] | Hamilton C H.Titanium science and technology[M].New York:Plenum Press,1973 |
| [20] | 郭伟 .Ti-6Al-4V/QA110-3-1.5异种材料扩散连接研究[D].长春:吉林大学,2006. |
| [21] | 何鹏,冯吉才,钱乙余.扩散连接界面物理接触行为的动态模型[J].焊接学报,2001(05):60-64. |
| [22] | 王艳芳,李涛.瞬间液相扩散连接模型及发展现状[J].热加工工艺,2007(11):66-69. |
| [23] | 韩靖,盛光敏,周小玲,孙建春.表面纳米化钛合金与不锈钢脉冲加压扩散连接[J].焊接学报,2008(10):37-40. |
| [24] | Wu G Q;Li Z F et al.Dynamic simulation of so-lid-state diffusion bonding[J].Materials Science and Engineering,2007,452:1263. |
| [25] | Chen H;Zhong Y;Hu W .A diffusion bonding model for the consolidation process of matrix-coated fiber-reinforced composites[J].Materials Science and Engineering,2007,452:625. |
| [26] | 邹家生.材料连接原理与工艺[M].哈尔滨:哈尔滨工业大学出版社,2005 |
| [27] | Derby B;Wallach E R .Theoretical model for diffusion bonding[J].Metal Science Journal,1982,16:49. |
| [28] | Guo Z X;Ridley N.Modelling of diffusion bonding of me-tals[J].Materials Science and Technology,1987(03):945. |
| [29] | Hill A;Wallach E R .Modelling solid-state diffusion bon-ding[J].Acta Metallurgica,1989,37(09):2425. |
| [30] | 高橘康夫 .表面/界面にはけゐ空孔举动[J].溶接学会志(日本),1995,64(04):79. |
| [31] | 高橘康夫;井上敬 .高温固相结合加工中のもザリンセモツミェしツョン(第2报):空孔扩散機にょゐ结合界面上の空隙收缩[J].高温学会志,1997,23(05):180. |
| [32] | 张贵锋,张建勋,包亚峰.日本关于固相扩散焊界面空洞收缩机理的研究[J].焊接,2001(10):14-18. |
| [33] | Orhan N;Aksoy M .Eroglu M A new model for diffusion bonding and its application to duplex alloys[J].Materials Science and Engineering,1999,A271:458. |
| [34] | Derby B;Wallach E R .Diffusion bonding:Development of theoretical model[J].Metals Science,1984,18:427. |
| [35] | Pilling J;Livesey D W et al.Solid state bonding in super-plastic Ti-6Al-4V[J].Metals Science,1984,18:117. |
| [36] | Johnson W.Plane strain slip line fields for metal de-formation processes[M].Oxford:pergamon Press,1982 |
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