用草酸盐共沉淀法制备了Y$_{0.25}$Bi$_{0.75}$O$_{1.5}$(YSB), 用X--ray衍射方法考察了其成相温度, 用交流阻抗法测试了其电导率. 与Ag复合制成复合阴极, 研究了烧结温度对复合阴极微结构的影响. 同时以Sm$_{0.2}$Ce$_{0.8}$O$_{1.9}$(SDC)为电解质, 用交流阻抗法研究YSB含量对复合阴极界面阻抗的影响. 用草酸盐共沉淀制备的YSB粉, 其电导率比SDC大得多. Ag--YSB复合阴极疏松多孔, Ag--YSB与SDC的界面结合良好, 形成了足够多的三相界面, 降低了界面极化电阻. YSB有一个最佳添加量, 电阻最小, 即电极界面性能最高. YSB的过量添加损坏Ag相的连续性, 降低氧的还原转化速度, 使界面的电阻增大.
Yttrium stabilized bismuth (Y$_{0.25}$Bi$_{0.7}$5O$_{1.5}$) (YSB) was synthesized using an oxalate coprecipitation method. YSB powder was fired at 900℃ for 5 h to form the fluorite structure as confirmed by X--ray diffraction. The conductivity was measured to be 0.057 S/cm at 600℃. Influences of sintering temperature on microstructure of Ag--YSB composites were investigated, and results indicate that lower sintering temperature resulted in high porosity and small particle size. Using SDC electrolyte, the interfacial resistance was found to be smallest for 50\% YSB ~about ~0.64 $\Omega\cdot$cm$^{2}$ ~at ~600℃ ~and 0.059 $\Omega\cdot$cm$^{2}$ at 700℃. The performance of Ag--YSB was much better than some perovskite cathodes, such as LSCF--SDC and LSM--SDC.
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