微孔聚酰亚胺不仅具有聚酰亚胺的低介电、耐高低温等特性,而且兼备了微孔材料的密度小、质轻等诸多优点,起始分解温度一般在250℃以上,介电常数一般在2.5左右,平均密度一般小于0.3g/cm3,在航空航天、微电子领域都有应用前景.综述了微孔聚酰亚胺的制备方法,结合耐热性能、力学性能、介电常数、吸声性能等的表征,总结了微孔聚酰亚胺的研究方法,并展望了微孔聚酰亚胺的应用前景.
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