本文用X射线衍射分析法研究了(Cu+1.0at.-％Ni)-Al-In和(Cu+1.0at.-％Sn)-Al-In系富铜合金相图的室温截面和500℃等温截面.结果表明,1.0at.-％Ni加入Al-Cu-In系富铜合金时,室温下A1和In在α-Cu中的固溶极限分别为10.8和2.7at.-％;在500℃时为19.0和10.5at.-％,而加入1.0at.-％Sn时,室温下Al和In在α-Cu中的固溶极限为18.7和4.9at.-％;在500℃时则为22.0和11.6at.-％,研究结果表明,少量Ni的添加,可使Al-Cu-In系富铜合金变为可热处理强化合金。
The room temperature and 500℃ isothermal sections for Cu-rich (Cu+1.0 at.-％Ni)-Al-In and (Cu+1.0 at.-％Sn)-AI-In phase diagrams have been determined using X-ray diffraction method. The solubilities of Al and In in α-Cu were found to be 10.8 and 2.7 at.-％, respectively, at room temperature, and to be 19.0 and 10.5at.-％, at 500℃, while 1.0 at.-％Ni was addition. However, in the case of 1.0 at.-％Sn addition, the corresponding solubility values become 18.7, 4.9, 22.0 and 11.6 at.-％, respectively. The results show that the addition of small content nickel makes Cu-rich Al-Cu-In alloys heat-treatable.
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