采用Ag_(70)-Cu_(28)-Ti_2活性焊料在真空条件下对AlN陶瓷和Mo-Ni-Cu合金进行活性封焊.分析焊区的显微组织形态、相组成,测定焊区力学性能和气密性.结果表明:在焊料层与合金的界面处Cu的含量相对较高,而在AlN陶瓷与焊料层的界面处形成了厚度为1～2 μm的富Ti层;经XRD分析发现,AlN陶瓷与焊料层的界面上有TiN存在,表明在AlN陶瓷与焊料层的界面处形成了化学键合.焊接后试样的气密性达到1.0×10~(-11) Pa·m~3/s,抗弯强度σ_b=78.55 MPa,剪切强度σ_τ=189.58 MPa.
AlN ceramics and Mo-Ni-Cu alloy were brazed actively by Ag_(70)-Cu_(28)-Ti_2 active solder in vacuum. The microstructure and phase composition of the brazed zone were analyzed and its mechanical properties and gas leakage were tested. Results show that Cu content is relatively high in the interface between the solder layer and the alloy; while Ti-rich layer with 1-2 μm thickness forms in the interface between the solder layer and AlN ceramics, where TiN is found by XRD, which indicates that there is chemical bonding in the AlN-solder interface. The gas leakage rate of the sample was 1.0 ×10~(-11) Pa·m~3/s, and the bending strength and shear strength were σb=78.55 MPa, and σ_τ=189.58 MP, respectively.
参考文献
| [1] | Sheng Zhu;Wladyslaw Wlosinski .Joining of AlN ceramic to metals using sputtered Al or Ti film[J].Journal of Materials Processing Technology,2001(3):277-282. |
| [2] | 刘鑫,张小勇,陆艳杰,方针正,楚建新.AlN陶瓷与无氧铜的活性封接[J].真空电子技术,2007(04):56-58. |
| [3] | 鲁燕萍,高陇桥.AlN陶瓷的薄膜金属化及其与金属的焊接研究[J].真空科学与技术学报,2000(03):190. |
| [4] | 李增峰,汤慧萍,刘海彦,张晗亮,谈萍,石英,黄愿平.活化元素Ni对Mo-Cu合金性能的影响[J].粉末冶金材料科学与工程,2006(03):185-封3. |
| [5] | Raymundo Arroyave;Thomas W. Eagar .Metal substrate effects on the thermochemistry of active brazing interfaces[J].Acta materialia,2003(16):4871-4880. |
| [6] | Kim T W;Chang H;Park S W .[J].Ceramic Engineering and Science Proceedings,2002,23(04):843. |
| [7] | Taranets N Y;Jones H .[J].Materials Science and Engineering A,2004,379:251. |
| [8] | Zhang Chunguang;Qiao Guanjun;Jin Zhihao .[J].Journal of the European Ceramic Society,2002,22:2181. |
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