概述了电子工业用贵金属中低温脆性钎料的最新研究进展,讨论了钎料合金的微观组织对加工性能的影响。发现大部分贵金属中低温钎料含有脆性相,使其难以加工成型。介绍了这类脆性钎料的加工成形工艺,提出了贵金属中低温钎料的研究方向。
The latest research progress on precious metals medium-low temperature brittle filler metals for electronic industry was summarized. And the effects of microstructure of solder alloys on processing performance were discussed. It was found that most of precious metals medium-low temperature filler metals contain brittle phases which make them difficult to process. In addition, the processing technologies of this kind of brittle filler metals were introduced and the research directions of precious metals medium-low temperature filler metals were pointed out.
参考文献
[1] | 张启运;庄鸿寿.钎焊手册[M].北京:机械工业出版社,1998:534-539. |
[2] | Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105. |
[3] | C.M.L. Wu;D.Q. Yu;C.M.T. Law;L. Wang .Properties of lead-free solder alloys with rare earth element additions[J].Materials Science & Engineering, R. Reports: A Review Journal,2004(1):1-44. |
[4] | Laurila T;Vuorinen V;Kivilahti JK .Interfacial reactions between lead-free solders and common base materials[J].Materials Science & Engineering, R. Reports: A Review Journal,2005(1/2):1-60. |
[5] | Katsuaki Suganuma;Seong-Jun Kim;Keun-Soo Kim .High-Temperature Lead-Free Solders: Properties and Possibilities[J].JOM,2009(1):64-71. |
[6] | Okamoto H;Massalski T B .The Au-Sn(gold-tin)system[J].Bulletin of Alloy Phase Diagrams,1984,5(05):492-503. |
[7] | 李金龙,谈侃侃,张志红,胡琼,罗俊,李双江.AuSn合金在电子封装中的应用及研究进展[J].微电子学,2012(04):539-546. |
[8] | 赵怀志;宁远涛.金[M].长沙:中南大学出版社,2003:312-315. |
[9] | Yoon JW;Chun HS;Jung SB .Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(1/2):119-125. |
[10] | Massalski T B;Okamoto H;Subramanian P R.Binary Alloy Phase Diagrams[M].ASM international,1990 |
[11] | C. LEINENBACH;F. VALENZA;D. GIURANNO;H.R. ELSENER;S. JIN;R. NOVAKOVIC .Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates[J].Journal of Electronic Materials,2011(7):1533-1541. |
[12] | 聂存珠,赵乃勤.金属基电子封装复合材料的研究进展[J].金属热处理,2003(06):1-5. |
[13] | Carl Zweben .Thermal Materials Solve Power Electronics Challenges[J].Power Electronics Technology,2006(2):40-47. |
[14] | Zweben C .Metal-matrix composites for electronic packaging[J].JOM,1992,44(07):15-23. |
[15] | 张济山.新型喷射成形轻质、高导热、低膨胀Si-Al电子封装材料[J].材料导报,2002(09):1-4. |
[16] | 李春元,王西涛,袁文霞.Ag-Au-Ge中温钎料的性能[J].北京科技大学学报,2008(12):1402-1405. |
[17] | 柳砚,徐锦锋,翟秋亚,刘虎林.低蒸气压中温钎料研究进展[J].铸造技术,2011(10):1435-1438. |
[18] | 崔大田,王志法,吴化波,刘金文.新型Au-19.25Ag-12.80Ge钎料的制备及性能[J].稀有金属材料与工程,2008(04):690-693. |
[19] | Hosking F M;Stephens J J;Rejent J A .Intermediate temperature joining of dissimilar metals[J].Welding Journal,1999,78(s):127-136. |
[20] | 莫文剑,王志法,崔大田.Au-Ag-Si钎料薄带加工工艺的研究[J].热加工工艺,2005(01):19-20. |
[21] | 莫文剑,王志法,姜国圣,王海山.Au-Ag-Si新型中温共晶钎料的研究[J].稀有金属材料与工程,2005(03):497-500. |
[22] | 崔大田,王志法,周俊,姜国圣,吴化波.Au-20.1Ag-2.5Si-2.5Ge新型中温钎料的组织与性能[J].中国有色金属学报,2007(09):1501-1505. |
[23] | Zwingmann G .Low melting carat gold brazing alloys for jewellery manufacture[J].Gold Bulletin,1978,11(01):9-14. |
[24] | 崔大田,王志法.快速凝固新型Au-Ag-Ge合金薄带的制备[J].材料热处理学报,2010(01):40-43. |
[25] | Borzone G;Hassam S;Bros J P .A note on the Ag-Au-Ge equilibrium phase diagram[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1989,20(10):2167-2170. |
[26] | Wang, J.;Liu, Y.J.;Tang, C.Y.;Liu, L.B.;Zhou, H.Y.;Jin, Z.P. .Thermodynamic description of the Au-Ag-Ge ternary system[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,2011(1/2):240-246. |
[27] | Hassam S;?gren J;Gaune-Escard M et al.The Ag-Au-Si system:Experimental and calculated phase diagram[J].Metallurgical Transactions A,1990,21(07):1877-1884. |
[28] | 刘泽光,陈登权,李伟,许昆,罗锡明,郭根生.新型中温金基钎料研究[J].贵金属,2010(02):41-48. |
[29] | 岳译新,谭澄宇,郑子樵,李世晨,叶建军.新型Ag-Cu-Ge钎料的性能及钎焊界面特征[J].中国有色金属学报,2006(10):1793-1798. |
[30] | 叶建军,涂传政,谭澄宇,岳译新,郑学斌.Ag-Cu-Ge-Sn新型中温焊膏的研制与应用[J].新技术新工艺,2007(05):42-44. |
[31] | 岳译新,谭澄宇,李世晨,郑子樵,李钢.新型中温钎料Ag-CU-Ge-Sn-Ni的初步研究[J].热加工工艺,2006(07):36-37,43. |
[32] | 宁远涛;赵怀志.银[M].长沙:中南大学出版社,2005:261-262. |
[33] | 刘泽光.Ag-Cu-In-Sn系低熔点钎料[J].贵金属,1991(03):17-25. |
[34] | 张惠 .Ag-Cu-In-Sn低温钎焊料制备技术的研究[D].中南大学,2008. |
[35] | Wang N;Wei B .Rapid solidification behavior of Ag-Cu-Ge ternary eutectic alloy[J].Materials Science and Engi-neering:A,2001,307(01):80-90. |
[36] | N. Wang;B. Wei .Rapid crystallization and growth mechanisms of highly undercooled Ag―Cu―Ge ternary alloy[J].Journal of Crystal Growth,2003(3/4):576-586. |
[37] | 王昭,吕文强,高松信,武德勇.Au80Sn20合金焊料制备工艺[J].强激光与粒子束,2012(09):2089-2093. |
[38] | 李伟,许昆,陈登权,罗锡明,刘毅.金锡合金钎料焊膏与箔材钎焊性能对比研究[J].贵金属,2013(01):25-28. |
[39] | Kimjo Yoshio .Manufacture of gold-tin alloy foils by electroplating for brazing[P].JP,200026989,1998-07-10. |
[40] | 刘欣,胡立雪,罗驰.电化学制备金锡合金薄膜技术研究[J].微电子学,2010(03):430-433. |
[41] | 刘文胜,黄宇峰,马运柱.Au80Sn20合金焊料的制备及应用研究进展[J].材料导报,2013(11):1-6. |
[42] | Tokuriki Honten K K .Gold sold alloy for electric components[P].JP,2015897A,1990-01-19. |
[43] | Tokuriki Honten Co Ltd .Method for pressing plate Au alloy brazing filler metal having low melting point[P].JP,3204190A,1991-09-05. |
[44] | 刘泽光;扬富陶;顾开源 .金锡钎料的制造方法[P].中国,10263940,1992-11-25. |
[45] | 刘泽光,陈登权,许昆,罗锡明,陈亮维.D-KH法制备金锡合金的组织与结构[J].贵金属,2005(03):30-33. |
[46] | 熊杰然 .光电子封装用金锡焊片的制备[D].华中科技大学,2008. |
[47] | 梅策香 .三元Ag-Cu-Ge共晶合金的快速晶体生长研究[D].西北工业大学,2006. |
[48] | 邹家生,许志荣,初雅杰,陈光.非晶态焊接材料的特性及其应用[J].材料导报,2004(04):17-19,26. |
[49] | 卢绍平,杨红梅,杨富陶,俞建树,柳青,王健.Zn对AgCuNi4-0.5合金性能的影响[J].贵金属,2013(01):21-24. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%