用金相观察了掺杂钨丝和纯钨丝在通电加热熔断断口处的孔洞结构。残留在钨丝中的钾对孔洞的生成起主要的作用。孔洞的形成和长大先是钾原子向晶界聚集,然后失去了钾原子的钾泡在高温下分解成空位和空位群,这些空位和空位群在晶体点阵中迁移,并向有钾原子聚集的晶界会合,才形成了一系列大小不等的孔洞。孔洞的生成导致局部地区的温度过高而熔断。
The hole-structure of doped or undoped W wire in close vicinity to the fused-breaking was observed by metallography. It was found that the K contained in the W wire plays an important role on the formation of hole. The K atoms may move and accumulate along the grain boundaries first. The residual K-bubbles from which the K atoms had lost may be disintegrated into many micropores under high temperature. These micropores migrate in the crystal lattice and collect themself at the grain boundaries where the K atoms accumulated already. A series of holes with various sizes are, therefore, formed. The fused-breaking will take place at the section where the local temperature raised rapidly to an unallow able limit due to the unadaptable increasing of electrical resistance across such section occurring holes.
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