Diamond/Al复合材料作为第四代电子封装材料,具有高热导率、低热膨胀系数和低密度等优良性能,成为研究重点.论述diamond/Al复合材料研究概况,分析挤压铸造、浸渗法和放电等离子烧结制备方法的优点和缺点,讨论热导率和热膨胀系数等热物理性能的影响因素,并对其发展前景进行展望.
参考文献
| [1] | 黄强,顾明元.电子封装用金属基复合材料的研究现状[J].电子与封装,2003(02):22-25. |
| [2] | 王超,彭超群,王日初,余琨,李超.AlN陶瓷基板材料的典型性能及其制备技术[J].中国有色金属学报,2007(11):1729-1738. |
| [3] | 钟鼓,吴树森,万里.高SiCp或高Si含量电子封装材料研究进展[J].材料导报,2008(02):13-17. |
| [4] | 甘卫平,陈招科,杨伏良,周兆锋.高硅铝合金轻质电子封装材料研究现状及进展[J].材料导报,2004(06):79-82. |
| [5] | 邹爱华 .电子封装SiC<,p>/Al复合材料热导率研究[D].南昌航空大学 |
| [6] | 尚青亮 .电子封装用金刚石/铜复合材料的研究[D].昆明:昆明理工大学,2009. |
| [7] | 解立川,彭超群,王日初,王小锋,蔡志勇,刘兵.高硅铝合金电子封装材料研究进展[J].中国有色金属学报,2012(09):2578-2587. |
| [8] | 彭卓玮,李劲风,郑子樵.高热导率低热膨胀系数Cu-ZrW2O8复合材料的制备与性能[J].粉末冶金材料科学与工程,2009(05):337-342. |
| [9] | 何新波,任树彬,曲选辉,郭志猛.电子封装用高导热金属基复合材料的研究[J].真空电子技术,2010(04):1-4. |
| [10] | JOHNSON W B;SONUPARLAK B .Diamond/Al metal matrix composites formed by the pressureless metal infiltration process[J].Materials Research Society,1993,8(05):1169-1173. |
| [11] | O. Beffort;F.A. Khaltd;L. Weber .Interface formation in infiltrated Al(Si)/diamond composites[J].Diamond and Related Materials,2006(9):1250-1260. |
| [12] | WEBER L;TAVANGAR R .Diamond-based metal matrix composites for thermal management made by liquid metal infiltration-potential and limits[J].Advanced Materials Research,2009,59:111-115. |
| [13] | 宋月清,夏扬,谢元锋,林晨光,郭志猛,曲选辉.金刚石热管理材料的研究进展[J].超硬材料工程,2010(01):1-8. |
| [14] | MIZUUCHI K;INOUE K;AGARI Y .Thermal properties of Al/diamond composites fabricated in continuous solid-liquid co-existent state by SPS[J].Materials Science Forum,2012,706/709:1967-1972. |
| [15] | 高文迦;贾成厂;褚克 .金刚石/金属基复合新型热管理材料的研究与进展[J].材料导报,2011,25(02):17-22,26. |
| [16] | 梁雪冰,褚克,贾成厂.放电等离子烧结制备Diamond/Al复合材料[J].复合材料学报,2008(06):192-197. |
| [17] | 沈晓宇,任淑彬,刘楠,何新波,曲选辉.放电等离子烧结法制备高导热金刚石/Al复合材料[J].粉末冶金材料科学与工程,2011(02):260-265. |
| [18] | 冯达,淦作腾.界面对封装用金刚石/铝复合材料性能的影响[J].半导体技术,2012(10):781-785. |
| [19] | 陈代刚,于家康,于威,袁曼.镀层厚度对镀钛金刚石/铝复合材料热导率的影响[J].中国有色金属学报,2013(03):802-808. |
| [20] | 甘可可;祁更新;陈 晓 .电子封装用金刚石增强金属基复合材料及其制备方法[P].中国,200910055065.5,2010-02-17. |
| [21] | TAN Z;LI Z;FAN G .Fabrication of diamond/aluminium composites by vacuum hot pressing:process optimization and thermal properties[J].COMPOSITES PART B-ENGINEERING,2013,47:173-180. |
| [22] | TAN Z;LI Z;FAN G .Diamond/aluminium composites processed by vacuum hot pressing:microstructure characteristics and thermal properties[J].Diamond and Related Materials,2013,31:1-5. |
| [23] | 齐丕骧.国内外挤压铸造技术发展概况[J].特种铸造及有色合金,2002(02):20-23. |
| [24] | 唐多光,张金龙,徐张翼,沈友良,程黔国.挤压铸造原理及缺陷分析[J].特种铸造及有色合金,2003(01):43-45. |
| [25] | 唐政 .颗粒增强铝基复合材料的制备及组织与性能研究[D].重庆大学,2009. |
| [26] | O. Beffort;S. Vaucher;F.A. Khalid .On the thermal and chemical stability of diamond during processing of Al/diamond composites by liquid metal infiltration (squeeze casting)[J].Diamond and Related Materials,2004(10):1834-1843. |
| [27] | 李信,龙剑平,胥明.金刚石颗粒/金属基复合材料的研究进展[J].特种铸造及有色合金,2012(07):654-656. |
| [28] | 冯号,于家康,薛晨,马明辉.电子封装用金刚石/铝复合材料的显微组织与热膨胀性能[J].热加工工艺,2010(14):59-62. |
| [29] | 刘永正.金刚石/铝复合材料影响因素研究[J].超硬材料工程,2009(05):15-17. |
| [30] | 刘永正,崔岩.超高导热金刚石/铝复合材料研究[C].第七届中国功能材料及其应用学术会议论文集,2010:439-441. |
| [31] | JOHNSON W B;SONUPARLAK B .Diamond/Al metal matrix composites formed by the pressureless metal infiltration process[J].Journal of Materials Research,1993,8(05):1169-1173. |
| [32] | MIZUUCHI K;INOUE K;AGARI Y .Processing of diamond particle dispersed aluminium matrix composites in continuous solid-liquid co-existent state by SPS and their thermal properties[J].Composites (Part B):Engineering,2011,42(04):825-831. |
| [33] | 贾成广;郭 静;孙久姗 .一种制备高导热性铝-金刚石双相连续复合材料的方法[P].中国,201010034134.7,2010-07-28. |
| [34] | CHU Ke,JIA Chengchang,LIANG Xuebing,CHEN Hui,GAO Wenjia.Effect of particle size on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering[J].稀有金属（英文版）,2009(06):646-650. |
| [35] | Flaquer J;Rios A;Martin-Meizoso A;Nogales S;Bohm H .Effect of diamond shapes and associated thermal boundary resistance on thermal conductivity of diamond-based composites[J].Computational Materials Science,2007(2):156-163. |
| [36] | Chu, K;Jia, CC;Liang, XB .Comment on "Effect of diamond shapes and associated thermal boundary resistance" [Comput. Mater. Sci. 41 (2007) 156-163][J].Computational Materials Science,2009(4):1142-1143. |
| [37] | Ke Chu;Chengchang Jia;Xuebing Liang;Hui Chen;Wenjia Gao;Hong Guo .Modeling the thermal conductivity of diamond reinforced aluminium matrix composites with inhomogeneous interfacial conductance[J].Materials & design,2009(10):4126-4135. |
| [38] | YAMAMOTO Y;IMAI T;TANABE K .The measurement of thermal properties of diamond[J].Diamond and Related Materials,1997,6(08):1057-1061. |
| [39] | 董应虎,何新波,罗铁刚,曲选辉.不同类型金刚石原始性能对比研究[J].矿业研究与开发,2011(05):43-45,57. |
| [40] | 马双彦,王恩泽,鲁伟员,王鑫.金刚石/铜复合材料热导率研究[J].热加工工艺,2008(04):36-38. |
| [41] | KHALID F;BEFFORT O;KLOTZ U .Microstructure and interracial characteristics of aluminium diamond composite materials[J].Diamond and Related Materials,2004,13(03):393-400. |
| [42] | 刘永正.低成本金刚石/铝复合材料的研究[J].材料导报,2013(04):8-11. |
| [43] | 尹洪峰;任耘;罗发.复合材料及其应用[M].西安:陕西科学技术出版社,2003 |
| [44] | Jianhua Wu;Hailong Zhang;Yang Zhang;Jianwei Li;Xitao Wang .Effect of copper content on the thermal conductivity and thermal expansion of Al-Cu/diamond composites[J].Materials & design,2012(Aug.):87-92. |
| [45] | RUCH P W;BEFFORT O;KLEINER S .Selective interracial bonding in Al(Si)-diamond composites and its effect on thermal conductivity[J].Composites Science and Technology,2006,66(15):2677-2685. |
| [46] | CHU K;JIA C;LIANG X .Effect of powder mixing process on the rnicrostructure and thermal conductivity of Al/diamond composites fabricated by spark plasma sintering[J].RARE METALS,2010,29(01):86-91. |
| [47] | 朱嘉琦;高 明;王永杰 .一种制备金刚石增强金属基复合材料的混料方法[P].中国,201110208956.7,2011-12-14. |
| [48] | 李荣久.陶瓷-金属复合材料[M].北京:冶金工业出版社,2004 |
| [49] | 林增栋 .金刚石表面金属化的技术[P].中国,85100286,1987-01-21. |
| [50] | 邓安强,樊静波,谭占秋,范根莲,李志强,张荻.金刚石/铜复合材料在电子封装材料领域的研究进展[J].金刚石与磨料磨具工程,2010(05):56-61. |
| [51] | PICKARD S M;WITHERS J C;LOUTFY R O .High thermal conductivity mental matrix composites[P].US,7641709,2010-01-05. |
| [52] | 张磊;崔岩 .一种高体积分数金刚石/铝导热功能复合材料的制备方法[P].中国,201110194213.9,2011-11-23. |
| [53] | LIANG Xuebing,JIA Chengchang,CHU Ke,CHEN Hui.Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings[J].稀有金属（英文版）,2011(05):544-549. |
| [54] | Wu, J.H.;Zhang, H.L.;Zhang, Y.;Li, J.W.;Wang, X.T..The role of Ti coating in enhancing tensile strength of Al/diamond composites[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2013:33-37. |
| [55] | TAN Z;LI Z;FAN G .Enhanced thermal conductivity in diamond/aluminium composites with a tungsten interface nanolayer[J].Materials and Design,2013,47:160-166. |
| [56] | TURNER P S .Thermal-expansion stresses in reinforced plastics[J].Journal of Research of the National Bureau of Stondards,1946,37(1/2):239-245. |
| [57] | KERNER E H .The elastic and thermo-elastic properties of composite media[J].Proceedings of the Physical Society,1956,69(08):808-813. |
| [58] | 宋美慧,修子扬,武高辉,宋涛.电子封装用Sip/Al复合材料的热物理性能研究[J].宇航材料工艺,2005(06):44-47. |
| [59] | 王新宇,于家康,朱晓敏.镀TiC金刚石/铝复合材料的界面及热膨胀性能[J].中国有色金属学报,2012(06):1718-1724. |
| [60] | 方针正,林晨光,张小勇,崔舜,楚建新.新型电子封装用金刚石/金属复合材料的组织性能与应用[J].材料导报,2008(03):36-39,43. |
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