导热膏填充的接触界面热阻由接触热阻和间隙热阻两部分组成。本文采用截锥体接触的单热流通道模型代替CMY模型中的圆盘接触的单热流通道模型,推导出了改进的接触热阻计算公式。本文还结合间隙热阻的计算公式,得到了一种改进的导热膏填充的接触界面热阻模型。通过分析得出了如下结论：对于使用导热膏填充的接触界面的热阻而言,其主要影响因素为接触表面的粗糙度和导热膏的导热系数,而接触界面间压力对其的影响则相对较小。
The thermal resistances of grease-filled interfaces consist of contact resistance and gap resistance.The single heat flux model of cut-off cone contact was used to replace CMY＇s disk contact model and an improved contact resistance equation was derived.Combined with gap resistance equation,an improved thermal joint resistance model was obtained.Based on this model,it can be found that for the resistance of grease-filled interfaces,the main influencing factors are roughness of contact surfaces and thermal conductivity of grease,however,pressure between contact surfaces has relative small influence.
参考文献
| [1] | 黄志华,韩玉阁,王如竹.用接触分热阻讨论接触热阻问题[J].上海交通大学学报,2001(08):1212-1215. |
| [2] | M. Michael Yovanovich .Four Decades of Research on Thermal Contact, Gap, and Joint Resistance in Microelectronics[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2005(2):182-206. |
| [3] | 黄志华,王如竹,韩玉阁.一种接触热阻的预测方法[J].低温工程,2000(06):40-46. |
| [4] | 刘菊 .固体界面接触热阻及导热系数测量的实验研究[D].华中科技大学,2011. |
| [5] | I. Savija;M. M. Yovanovich;J. R. Culham;E. E. Marotta .Thermal Joint Resistance of Conforming Rough Surfaces with Grease-Filled Interstitial Gaps[J].Journal of thermophysics and heat transfer,2003(2):278-282. |
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